초록 ▼

A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass

A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.

대표청구항 ▼

A package adapted to encase an electronic component, comprising; a metallic base component split into first and second base layers, said first and second base layers bonded together at an interface with a layer of electrically insulating sealing material wherein said interface is non-planer and incr

A package adapted to encase an electronic component, comprising; a metallic base component split into first and second base layers, said first and second base layers bonded together at an interface with a layer of electrically insulating sealing material wherein said interface is non-planer and increases the area of contact between said first and second base layers; a metallic lid component disposed on said base component so as to form an enclosure adapted to receive said electronic component; a metallic leadframe, said leadframe being disposed between said lid component and said base component; and a sealing material sealing said lid component to said base component with said leadframe there between.