초록 ▼

A support element supports the integrated circuit chip of an electronic memory card. The support element is used for positioning the chip inside a mold cavity and the card body is formed by injecting plastic material (e.g., ABS) into the cavity so that the chip is embedded in the plastic. The suppor

A support element supports the integrated circuit chip of an electronic memory card. The support element is used for positioning the chip inside a mold cavity and the card body is formed by injecting plastic material (e.g., ABS) into the cavity so that the chip is embedded in the plastic. The support element may be constituted of a film which is peeled off the finished card or it may be constituted of a sheet which remains as an integral part of the card. The support element may include graphics elements for decorating the card face. If the support element is a peel-off film, then the graphics elements are transferred and remain visible on the card. If the support element remains as an integral part of the card, then the graphics elements are formed on a face thereof which is visible in the finished card.

대표청구항 ▼

A method of manufacturing a memory card comprising a card body having two mutually parallel main faces and a memory module including an access face disposed in one of the main faces of the card body, comprising the steps of: providing a mold whose mold cavity defines the outside shape of said card a

A method of manufacturing a memory card comprising a card body having two mutually parallel main faces and a memory module including an access face disposed in one of the main faces of the card body, comprising the steps of: providing a mold whose mold cavity defines the outside shape of said card and including two main walls for defining said two faces of the card body; providing a support element having two oppositely facing surfaces; providing a memory module having an access face; fixing the access face of said memory module to one of the surfaces of the support element; placing said support element in said mold such that its periphery is fixed to said mold with the memory module being in said mold cavity; injecting a plastic material into said mold so that the plastic material fills said mold cavity and presses the other of the surfaces of the support element against one of the two main walls of the mold cavity so that substantially the entirety of said memory module, except for its access face, is embedded in the plastic material; and unmolding the part obtained in this way, and forming one of said two main faces of the card body by separating the support element from said part, thereby causing said memory module to be inserted in the card body with said access face of the memory module being disposed in said one main face of the card body.