초록 ▼

The heat sinking substrate herein disclosed is comprised of a core consisting of a rigid graphitic solid in which hexagonal graphite crystallites are bond together by coal tar pitch, the core being enclosed by two metallic face sheets having a coefficient of thermal expansion suited to the electroni

The heat sinking substrate herein disclosed is comprised of a core consisting of a rigid graphitic solid in which hexagonal graphite crystallites are bond together by coal tar pitch, the core being enclosed by two metallic face sheets having a coefficient of thermal expansion suited to the electronic packages it supports. The substrate is designed to be installed into a module with a printed wiring board on either side, the module being installed in parallel with other like modules into a chassis. The heat generated by the electronics is input over the face of the substrate and withdrawn by cooling in the walls of the chassis with which the substrates are in good thermal contact. The grain of the core is aligned for maximum thermal conduction along the path to the chassis walls. The substrate is of low weight, has a CTE matched to the supported electronic packages, high thermal conductance, and uses low cost materials.

대표청구항 ▼

A heat sinking substrate for surface mounted electronic device packages, said substrate comprising, in combination: A. a core consisting of a rigid graphitic solid in which hexagonal graphite crystallites are bound together by pitch, said core having opposed, planar surfaces; and B. a metallic face

A heat sinking substrate for surface mounted electronic device packages, said substrate comprising, in combination: A. a core consisting of a rigid graphitic solid in which hexagonal graphite crystallites are bound together by pitch, said core having opposed, planar surfaces; and B. a metallic face sheet adhered to each planar surface, each face sheet having a coefficient of thermal of expansion suited to said packages.