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Inspecting apparatus for determining presence and location of foreign particles on reticles or pellicles

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/88
출원번호 US-0298920 (1989-01-19)
우선권정보 JP-0011725 (1988-01-21)
발명자 / 주소
  • Hayano Fuminori (Kamakura JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX)
출원인 / 주소
  • Nikon Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 59  인용 특허 : 4

초록

A defect inspecting apparatus for determining the presence of a defect element adhering to either of the front and back surfaces of a thin film-like object to be inspected (the object having a light-transmitting property) applies two light beams of different wavelengths to a surface of the object an

대표청구항

A defect inspecting apparatus for determining the presence of a defect element adhering to either of the front and back surfaces of a thin film-like object to be inspected having a light-transmitting property, comprising: applying means for applying two light beams of different wavelengths to one su

이 특허에 인용된 특허 (4)

  1. Shiba Masataka (Yokohama JPX) Uto Sachio (Yokohama JPX) Koizumi Mitsuyoshi (Yokohama JPX), Foreign particle detecting method and apparatus.
  2. Tanimoto Akikazu (Kawasaki JPX) Imamura Kazunori (Tokyo JPX), Foreign substance inspecting apparatus.
  3. Tanimoto Akikazu (Yokohama JPX) Imamura Kazunori (Tokyo JPX), Foreign substance inspecting apparatus.
  4. Slaker Frank A. (Norwalk CT), Multiple source laser scanning inspection system.

이 특허를 인용한 특허 (59)

  1. Gordon,Joseph S; Hughes,Gregory P; Kalk,Franklin D; Alpay,Hakki U, Apparatus and method for optimizing a pellicle for off-axis transmission of light.
  2. Shu, Emily Yixie; Paul, Goutam, Characterizing in-situ deformation of hard pellicle during fabrication and mounting with a sensor array.
  3. Moriya Kazuo,JPX, Defect evaluation apparatus for evaluating defects and shape information thereof in an object or on the surface of an object.
  4. Wilner, Corey Steven; Kremin, Viktor, Discerning between substances.
  5. Aoki, Takashi; Owa, Soichi, Exposure apparatus, exposure method, and device manufacturing method.
  6. Hunt, Jeffrey H., Fiber-optic based surface spectroscopy.
  7. Maeda, Kohei, Foreign particle inspection apparatus, exposure apparatus, and method of manufacturing device.
  8. Fairley,Christopher R; Fu,Tao Yi; Perelman,Gershon; Tsai,Bin Ming Benjamin, High throughput brightfield/darkfield wafer inspection system using advanced optical techniques.
  9. Fairley, Christopher R.; Fu, Tao Yi; Perelman, Gershon; Tsai, Bin Ming Benjamin, High throughput darkfield/brightfield wafer inspection system using advanced optical techniques.
  10. Fairley,Christopher R.; Fu,Tao Yi; Perelman,Gershon; Tsai,Bin Ming Benjamin, High throughput darkfield/brightfield wafer inspection system using advanced optical techniques.
  11. Yatsugake Yasuo,JPX ; Okawa Takashi,JPX ; Mizutani Norihiko,JPX ; Iizuka Shigeharu,JPX, Inspection method and device of wafer surface.
  12. Eremin Yuri A.,RUX ; Stover John C. ; Scheer Craig A., Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light.
  13. Danko, Joseph J., Method and apparatus for inspecting a patterned semiconductor wafer.
  14. Danko, Joseph J., Method and apparatus for inspecting a patterned semiconductor wafer.
  15. Matsumoto, Shunichi; Ueno, Taketo; Taniguchi, Atsushi, Method and apparatus for inspecting defect.
  16. Blaesing-Bangert Carola,DEX ; Rinn Klaus,DEX ; Kaczynski Ulrich,DEX ; Beck Mathias,DEX, Method and device for measuring structures on a transparent substrate.
  17. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  18. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  19. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  20. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  21. John C. Stover ; Yuri A. Eremin RU, Method for discriminating between holes in and particles on a film covering a substrate.
  22. Carlos Strocchia-Rivera, Method of monitoring ion implants by examination of an overlying masking material.
  23. Mitsuru Hayamizu JP; Yoshihiko Nagata JP, Method, apparatus, and system for inspecting transparent objects.
  24. Shortt, David; Biellak, Stephen; Belyaev, Alexander, Methods and systems for inspection of a wafer.
  25. Lin, Yungyu, Mother glass inspection device and mother glass inspection method.
  26. Meeks, Steven W., Multi-wavelength system and method for detecting epitaxial layer defects.
  27. Chen Bor-Cheng,TWX ; Wann Yeh-Jye,TWX, Multiple focal plane image comparison for defect detection and classification.
  28. Rosengaus, Eliezer, Oblique incidence macro wafer inspection.
  29. Leslie Brian C. ; Nikoonahad Mehrdad ; Wells Keith B., Optical scanning system for surface inspection.
  30. Leslie, Brian C.; Nikoonahad, Mehrdad; Wells, Keith B., Optical scanning system for surface inspection.
  31. Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
  32. Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
  33. Kim,Sang Hun, Particle detecting system and method of detecting particles using the same.
  34. Kawahara, Atsushi, Particle inspection apparatus, exposure apparatus, and device manufacturing method.
  35. Kawahara, Atsushi, Particle inspection apparatus, exposure apparatus, and device manufacturing method.
  36. Takehisa, Kiwamu; Tajima, Atsushi; Kusunose, Haruhiko, Pellicle inspection apparatus.
  37. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  38. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  39. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  40. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  41. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  42. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  43. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  44. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  45. Nikoonahad, Mehrdad; Stokowski, Stanley E., Scanning system for inspecting anamolies on surfaces.
  46. Nikoonahad Mehrdad ; Stokowski Stanley E., Scanning system for inspecting anomalies on surfaces.
  47. Nikoonahad Mehrdad ; Stokowski Stanley E., Scanning system for inspecting anomalies on surfaces.
  48. Nikoonahad,Mehrdad; Stokowski,Stanley E., Scanning system for inspecting anomalies on surfaces.
  49. Sekine Akihiko,JPX ; Iwa Yoichiro,JPX ; Soma Hiroaki,JPX ; Miki Naoto,JPX ; Isozaki Hisashi,JPX ; Yoshino Hisakazu,JPX, Surface inspection apparatus.
  50. Isozaki,Hisashi; Yamazaki,Michihiro; Yoshikawa,Hiroshi; Takase,Takehiro; Shida,Yutaka; Iwa,Yoichiro, Surface inspection method and apparatus.
  51. Isozaki,Hisashi; Enomoto,Yoshiyuki, Surface inspection system.
  52. Jordan ; III John R. ; Nikoonahad Mehrdad ; Wells Keith B., Surface inspection system.
  53. Clementi Lee D. ; Fossey Michael E., Surface inspection system and method of inspecting surface of workpiece.
  54. Nikoonahad Mehrdad ; Wayman Charles E., Surface inspection system with misregistration error correction and adaptive illumination.
  55. Biellak, Steve; Stokowski, Stanley E.; Vaez-Iravani, Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  56. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  57. Fossey Michael E. ; Stover John C., Wafer inspection system for distinguishing pits and particles.
  58. Fossey Michael E. ; Stover John C. ; Clementi Lee D., Wafer inspection system for distinguishing pits and particles.
  59. Fossey, Michael E.; Stover, John C.; Clementi, Lee D., Wafer inspection system for distinguishing pits and particles.
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