초록

A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.

대표청구항 ▼

A test frame adapted to support and electrically connect to an electronic device, comprising: a first ring frame containing a plurality of interior slots incompletely circumscribing a central portion of said first ring frame and a plurality of external slots incompletely circumscribing both said cen

A test frame adapted to support and electrically connect to an electronic device, comprising: a first ring frame containing a plurality of interior slots incompletely circumscribing a central portion of said first ring frame and a plurality of external slots incompletely circumscribing both said central portion of said first ring frame and said interior slots; a second ring frame sized to fit within an area defined by the inner edges of said exterior slots and the outer edges of said interior slots; a metallic foil disposed between said first and second ring frames; and a means for bonding said metallic foil to said first and second ring frames.