초록 ▼

An electronic device which includes a circuit sheet having a conductive path thereon. An adhesive is deposited on the conductive path, the adhesive including a nonconductive base incorporating randomly spaced conductive particles. A circuit component is forced through the adhesive, the conductive pa

An electronic device which includes a circuit sheet having a conductive path thereon. An adhesive is deposited on the conductive path, the adhesive including a nonconductive base incorporating randomly spaced conductive particles. A circuit component is forced through the adhesive, the conductive path and the circuit sheet carrying a portion of the adhesive therewith between the circuit component and the conductive path. The carried portion of the adhesive is compressed for establishing contact between the conductive particles and thereby conductivity between the circuit component and the conductive path leaving the adhesive other than that portion in a nonconductive state.

대표청구항 ▼

An electronic device, comprising: a mounting surface having a clearance hole therein; a circuit sheet on the mounting surface and having a conductive path thereon overlapping the clearance hole in the mounting surface; an adhesive deposited on the conductive path over the area of the clearance hole,

An electronic device, comprising: a mounting surface having a clearance hole therein; a circuit sheet on the mounting surface and having a conductive path thereon overlapping the clearance hole in the mounting surface; an adhesive deposited on the conductive path over the area of the clearance hole, the adhesive including a nonconductive base incorporating spaced conductive particles; a circuit component for forcing through the adhesive, the conductive path and the circuit sheet and into the clearance hole in the mounting surface; and wherein the circuit sheet has sufficient flexibility to deform as the circuit component passes therethrough carrying a portion of the adhesive therewith between the circuit component and the conductive path, and the circuitry sheet has sufficient rigidity to compress said portion of the adhesive for establishing electrical contact between the conductive particles and thereby conductivity between the circuit component and the conductive path leaving the adhesive other than said portion in a nonconductive state.