초록 ▼

A process and apparatus for etching semiconductor surfaces, in particular, silicon, with a mixture containing nitrogen-oxygen based compounds as oxidizing compounds, hydrofluoric acid as the component which dissolves the oxidation product, and sulfuric acid, optionally with phosphoric acid added, as

A process and apparatus for etching semiconductor surfaces, in particular, silicon, with a mixture containing nitrogen-oxygen based compounds as oxidizing compounds, hydrofluoric acid as the component which dissolves the oxidation product, and sulfuric acid, optionally with phosphoric acid added, as a carrier medium. This mixture makes it possible to design the process as a cyclic process in which oxygen supplied to the system ultimately effects an oxidation of the material to be etched, and the product of its oxidation is removed from the circuit. The process is noteworthy for its low usage of reagents and because it is not harmful to the environment.

대표청구항 ▼

A process for etching the surface of an elementary semiconductor by the combined action of an oxidizing agent, which oxidizes the elementary semiconductor and produces an oxidation product, and a dissolving agent which dissolves the oxidation product, comprising the steps of: contacting said element

A process for etching the surface of an elementary semiconductor by the combined action of an oxidizing agent, which oxidizes the elementary semiconductor and produces an oxidation product, and a dissolving agent which dissolves the oxidation product, comprising the steps of: contacting said elementary semiconductor with a solution comprising said oxidizing agent and said dissolving agent in an acid carrier medium, said acid carrier medium including a member selected from the group consisting of sulfuric acid, phosphoric acid, phosphorus oxide and combinations thereof, wherein contacting said oxidizing agent with said elementary semiconductor results in the production of an oxidation product and a reduction product, and wherein said dissolving agent dissolves said oxidation product resulting in the production of a dissolution product, supplying oxygen to said solution to reoxidize said reduction product resulting in the reformation of the oxidizing agent, liberating said dissolving agent from said dissolution product and forming a solid reaction product, separating off and removing said solid reaction product and recirculating liberated dissolving agent and reformed oxidizing agent in said acid carrier medium.