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High purity epoxy formulations for use as die attach adhesives 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01B-001/06
출원번호 US-0350987 (1989-05-12)
발명자 / 주소
  • Chen Shuhchung S. (Belle Mead NJ) Schoenberg Jules E. (Scotch Plains NJ) Park Song (Fullerton CA)
출원인 / 주소
  • National Starch and Chemical Investment Holding Corporation (Wilmington DE 02)
인용정보 피인용 횟수 : 13  인용 특허 : 21

초록

This invention presents improved epoxy-based die attach adhesives which are of low viscosity, high ionic purity, and stable toward thermal cycling. This improvement is obtained by including in the formulation carboxy terminated polymers which are the reaction products of polyether diols with cyclic

대표청구항

In an epoxy-based die-attach adhesive composition, wherein the adhesive comprises one or more curable epoxy compounds, a conductive filler, and suitable curing agents the improvement comprising adding to said adhesive 2-50 PHR (by wt.) of an epoxy modifier which comprises a carboxy-terminated polyme

이 특허에 인용된 특허 (21)

  1. Baer Robert B. (San Antonio TX), Coating method and composition for the sacrificial protection of metal substrates.
  2. Jones Robert J. (Hermosa Beach CA), Curable aliphatic epoxy-polimide compositions.
  3. Tieke Bernd (Giffers CHX) Zahir Sheik A. (Oberwil CHX) Finter Jrgen (Freiburg/Br. DEX), Curable mixtures containing copolymerizable dibenzalacetone palladium complexes.
  4. Tsuboi Hikotada (Yokohama JPX) Kawamata Motoo (Yokohama JPX) Oba Masayuki (Yokohama JPX) Koga Nobuhito (Yokohama JPX), Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition.
  5. Charneski Mitchell D. (25900 Mulberry Dr. Southfield MI 48034) Kelley James K. (9188 Grafton Rd. Carleton MI 48117) Gazdecki Frank J. (11243 Wynn Dr. Pinckney MI 48169), Electrical joint compound.
  6. Zahir ; Abdul-Cader ; Renner ; Alfred, Epoxide resin mixtures.
  7. Togashi Eiki (Ichihara JPX) Takata Toshimasa (Ichihara JPX), Epoxy resin composition.
  8. Robins Janis (St. Paul MN) Wright Charles D. (Birchwood MN), Fast curing epoxy resin compositions.
  9. Fukami Akira (Amagasaki JPX) Nakajima Hiroyuki (Amagasaki JPX), Heat resistant resin composition.
  10. Chesney ; Jr. Joseph J. (Plainsboro NJ) Schaefer Robert E. (Hillsdale NJ), High temperature resistant adhesive bonding composition of epoxy resin and two-part hardener.
  11. Dietz Raymond L. (Poway CA) Featherby Michael (San Diego CA) Margetts Peter K. (El Cajon CA), Method of bonding an electronic device to a ceramic substrate.
  12. Banucci ; Eugene G. ; Boldebuck ; Edith M., Novel polyetheramide-imide epoxy resin blends.
  13. Iwasa Yamahiro (Hachioji JPX), Power conductive coating mixed with copper powder.
  14. Goswami Jagadish C. (New City NY) Rehder Richard A. (Mahopac NY) DeSalvo Anthony L. (Greenwich CT), Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker.
  15. Keil Joseph W. (Midland MI), Silicone-modified epoxy resins having improved impact resistance.
  16. Dietz Raymond L. (Poway CA) Featherby Michael (San Diego CA) Margetts Peter K. (El Cajon CA), Silver-filled glass.
  17. Dietz Raymond L. (Poway CA) Featherby Michael (San Diego CA) Margetts Peter K. (El Cajon CA), Silver-filled glass.
  18. DiSalvo, Anthony L.; Kim, Ki-Soo, Solventless, polyimide-modified epoxy composition.
  19. Goswami Jagadish C. (New City NY) Aurichio Joseph A. (Anderson SC) Zingaro Joseph R. (Fairfield CT), Thermally stable adhesive.
  20. Goswami Jagadish C. (New City NY) Aurichio Joseph A. (Anderson SC), Thermally stable adhesive comprising soluble polyimide resin and epoxy resin.
  21. Prabhu Ashok N. (Plainsboro NJ) Boardman Simon M. (Holland PA), Thick film resistor inks.

이 특허를 인용한 특허 (13)

  1. Sachdev Krishna Gandhi ; Berger Michael ; Call Anson Jay ; Pompeo Jr. Frank Louis, Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin.
  2. Sachdev Krishna Gandhi ; Berger Michael ; Call Anson Jay ; Pompeo ; Jr. Frank Louis, Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin.
  3. Lake, Rickie C., Battery powerable apparatus, radio frequency communication device, and electric circuit.
  4. Chen Andrew (Covina CA) Frentzel Richard L. (Chino Hills CA), Conductive adhesive useful for bonding a semiconductor die to a conductive support base.
  5. Appelt, Bernd Karl; Johansson, Gary Alan; Papathomas, Konstantinos I., Die attachment with reduced adhesive bleed-out.
  6. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  7. Ghoshal Ramkrishna ; Mukerji Prosanto, Epoxy resin composition with cycloaliphatic epoxy-functional siloxane.
  8. Lake, Rickie C., Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit.
  9. Ravikiran, Ramakrisha; Ng, Hendra; Puthenkovilakom, Rajesh Raja; Zhang, Linda; Amoroso, Dino; Knapp, Brian; Bell, Andrew; Rhodes, Larry F., Polycycloolefin polymeric compositions for semiconductor applications.
  10. Tuttle, John R., Radio frequency identification device and method.
  11. Tuttle, John R., Radio frequency identification device and method.
  12. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  13. Lake,Rickie C., Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit.
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