초록 ▼

A method of interconnecting circuit components in a semiconductor integrated circuit including component elements formed in the substrate and thin-film resistors and capacitors formed on a surface of the substrate, a molybdenum plug is utilized to facilitate stable, uniform low resistance contacts t

A method of interconnecting circuit components in a semiconductor integrated circuit including component elements formed in the substrate and thin-film resistors and capacitors formed on a surface of the substrate, a molybdenum plug is utilized to facilitate stable, uniform low resistance contacts to circuit elements, molybdenum (moly) plugs are utilized as a barrier between interconnect metallization and the circuit components. A CLAD moly/aluminum metallization interconnect can be fabricated in a standard process in which the moly plugs are formed. The accuracy and stability of thin-film resistors is facilitated during wafer processing, laser trimming, temperature cycling, and assembly processing thereby providing repeatable matching by eliminating contact resistance as a process variable.

대표청구항 ▼

In the fabrication of an integrated circuit having at least one thin-film resistor, a method of interconnecting the thin-film resistor with other circuit components comprising the steps of: providing a semiconductor substrate with circuit components formed therein, forming a thin-film resistor on a

In the fabrication of an integrated circuit having at least one thin-film resistor, a method of interconnecting the thin-film resistor with other circuit components comprising the steps of: providing a semiconductor substrate with circuit components formed therein, forming a thin-film resistor on a major surface of said substrate, depositing an insulation layer on said thin-film resistor, annealing said thin-film resistor, forming contact openings through said insulation layer to said thin-film resistor, depositing molybdenum on said semiconductor substrate and on said thin-film resistor, selectively etching said molybdenum to define molybdenum plugs in said contact openings, depositing interconnect metallization on said semiconductor substrate, said insulation layer, and said molybdenum plugs, selectively etching said interconnect metallization to define an interconnect pattern, and alloying said semiconductor substrate.