초록 ▼

A high performance plastic-encapsulated integrated circuit package is disclosed having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes below the signal lines which includes an electrically conductive heat sink member on which an integrat

A high performance plastic-encapsulated integrated circuit package is disclosed having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes below the signal lines which includes an electrically conductive heat sink member on which an integrated circuit die is centrally and directly mounted for dissipating heat while providing electrical insulation therebetween and which may also may function as a ground or power plane, a peripheral printed circuit board having electrically conductive members formed on one or more surfaces thereof, one surface of which is also mounted to the heat sink and electrically separated therefrom and which surrounds the centrally mounted die on the heat sink, and a lead frame assembly bonded to an opposite surface of the printed circuit board. Terminal pads on the die are connected respectively to leads on the lead frame, to the electrically conductive members on the printed circuit board, and to the electrically conductive heat sink. Terminal pads on one surface of the printed circuit board may be used in combination with electrically conductive vias to provide electrical connection to the other surface of the printed circuit board as well as to the electrically conductive heat sink.

대표청구항 ▼

A high performance plastic-encapsulated integrated circuit package characterized by both improved heat dissipation and low ground noise comprising one or more separate planes selected from the class consisting of a ground plane, a power plane, and combinations of same disposed in a parallel plane; a

A high performance plastic-encapsulated integrated circuit package characterized by both improved heat dissipation and low ground noise comprising one or more separate planes selected from the class consisting of a ground plane, a power plane, and combinations of same disposed in a parallel plane; and signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive heat sink member capable of dissipating heat and which may also function as a ground or power plane; (b) an integrated circuit die having a first surface centrally and directly bonded to a first surface of said heat sink member, while providing electrical insulation therebetween, and having side surfaces thereon; (c) a printed circuit board, having a first surface, at least a portion of which is bonded to said first surface on said heat sink member to peripherally surround said side surfaces of said centrally mounted die on said heat sink surface, and a second surface on which is formed one or more electrically conductive members; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrically connected at their inner ends respectively: (i) to terminal pads on said integrated circuit die; (ii) to said one or more of said electrically conductive members on said second face of said printed circuit board; and (iii) to said electrically conductive heat sink member; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board, and said lead frame except for outer ends of said leads thereon.