초록 ▼

A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel. The package comprises a heat insulating vacu

A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel. The package comprises a heat insulating vacuum vessel capable of maintaining the interior thereof at a low temperature, a substrate having mounted thereon superconducting devices and disposed within the heat insulating vacuum vessel, another substrate having mounted thereon semiconductor devices and disposed outside the heat insulating vacuum vessel, and film cables electrically connecting the respective circuit patterns of these substrates. Since the thickness of the film cables are very small, the rate of influx of heat that flows into the heat insulating vacuum vessel can be limited to a low value.

대표청구항 ▼

A package for electronic devices, comprising: heat insulating vacuum vessel means capable of maintaining the interior thereof at a low temperature: a first substrate provided with circuit patterns and having mounted thereon first electronic devices suitable for operation at a low temperature, said f

A package for electronic devices, comprising: heat insulating vacuum vessel means capable of maintaining the interior thereof at a low temperature: a first substrate provided with circuit patterns and having mounted thereon first electronic devices suitable for operation at a low temperature, said first substrate being disposed within the heat insulating vacuum vessel means; a second substrate provided with circuit patterns and having mounted thereon second electronic devices suitable for operation at a room temperature, said second substrate being disposed outside the heat insulating vacuum vessel means, said first and second substrates being attached to said heat insulating vacuum vessel means substantially in the same plane; and connecting means for penetrating the heat insulating vacuum vessel means and electrically connecting the circuit patterns of the first substrate and those of the second substrate.