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Flexible printed circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/18
출원번호 US-0346134 (1989-05-02)
우선권정보 FR-0006201 (1988-05-09)
발명자 / 주소
  • Champagne Daniel (Septeuil FRX) Le Loc\h Alain (Versailles FRX) Lefort Olivier (Vernon FRX)
출원인 / 주소
  • Bull CP8 (Trappes FRX 03)
인용정보 피인용 횟수 : 34  인용 특허 : 7

초록

A flexible printed circuit having contacts and associated leads which are connected to the contacts. The contacts are disposed at a first zone and the leads are for connection from this zone to a second zone of the circuit which is at a distance from the first zone. The leads run from the respective

대표청구항

A printed circuit comprising: conductive contacts; and conductive leads which are each connected to a respective contact at a first zone of the circuit, and which are each connected to a respective second contact in a second zone, said second zone of the circuit located at a distance from the first

이 특허에 인용된 특허 (7)

  1. Juan Alain (Chzard CHX), Electronic unit especially for microcircuit cards and card comprising such a unit.
  2. Hara Kazuya (Tokyo JPX), IC card.
  3. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX) Nakano Harumi (Tokyo JPX), IC card.
  4. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), IC-module identification card.
  5. Dehaine Grard (Chatillon FRX) Peytavy Alain (Versailles FRX), Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electron.
  6. Juan Alain (Chzard CHX) Vuilleumier Jean-Claude (Cressier CHX), Method of manufacture of electronic modules for cards with microcircuits.
  7. Hara Kazuya (Tokyo JPX), Multiple application electronic card-like apparatus.

이 특허를 인용한 특허 (34)

  1. Boccia,Henri; Brunet,Olivier; Patrice,Philippe; Limousin,Isabelle, Adapter for a chip card having a reduced format in comparison with the standard SIM mini-card format.
  2. Stampka, Peter; Puschner, Frank; Heinemann, Erik; Binder, Birgit, Chip module and chip card.
  3. Reiffel,Leonard, Combined imaging coded data source data acquisition.
  4. Pieterse Rob,NLX ; Hopman Remco Jack Bernhard,NLX, Connector formed as a sleeve pushed over a standard chip card.
  5. Leighton, Keith R., Hot lamination process for the manufacture of a combination contact/contactless smart card.
  6. Leighton Keith, Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom.
  7. Carichner Karla Y., Integrated circuit package having bond fingers with alternate bonding areas.
  8. Florek, Miroslav; Mihályová, Tatiana, Memory card.
  9. Slupek Darrell J. ; Clowers Becky J., Pad with indentations surface mount.
  10. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification ca.
  11. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards.
  12. Beals, William Michael; Goupil, Hervé, Smart card interface.
  13. Beals, William Michael; Goupil, Hervé, Smart card interface.
  14. Beals, William Michael; Goupil, Hervé, Smart card interface.
  15. Beals, William Michael; Goupil, Hervé, Smart card interface.
  16. Beals, William Michael; Goupil, Hervé, Smart card interface.
  17. Beals, William Michael; Goupil, Hervé, Smart card interface.
  18. Beals, William Michael; Goupil, Hervé, Smart card interface.
  19. Beals, William Michael; Goupil, Hervé, Smart card interface.
  20. Fries, Manfred; Fischer, J?rgen; Houdeau, Detlef, Smart card module for biometric sensors.
  21. Maus, Christopher; Maus, Brandon, Smartcard with iChip contact pad.
  22. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  23. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  24. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  25. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  26. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  27. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  28. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  29. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  30. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.
  31. Perrine, Jerome; Goupil, Hervé; van Riek, Maurice Gerard; Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, USB interface for performing transport I/O.
  32. Keith R. Leighton, Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  33. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  34. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.
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