초록 ▼

The disclosure describes a form of packaging for an electronic device and a method of achieving it in order to overcome the problem of damage because of cycles in environmental temperature. A thin, flexible foil functioning as a carrier of electrically conductive material selected from the group inc

The disclosure describes a form of packaging for an electronic device and a method of achieving it in order to overcome the problem of damage because of cycles in environmental temperature. A thin, flexible foil functioning as a carrier of electrically conductive material selected from the group including Invar, copper-Invar-copper and Kovar is coated with a preselected polyimide, on which is formed a thin metallized coating of chromium, in the order to 200 Angstroms, and copper, in the order of 80,000 Angstroms. A predetermined electrical circuit is formed out of this metallized coating by a photolithographic process and is connected electrically to the flexible metal foil by vias through the polyimide coating. At least one electronic device is bonded to the electrical circuit at a predetermined location to operate functionally with the circuit, and both the device and the circuit are connected electrically by the vias to the thin, metal carrier which functions as a power plane for the package.

대표청구항 ▼

The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predet

The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predetermined locations through to communicate with said flexible carrier; metallizing said layer of electrically insulating material to include said vias; and forming an electronic circuit from said metallization of said insulating material.