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A programmable, dynamically adjustable die stamping apparatus for die-stamping of cardboard blanks used in production of packaging trays, and a process for operating such apparatus. The apparatus includes a dimensionally adjustable die having a plurality of separate movable parts each coupled to thr

A programmable, dynamically adjustable die stamping apparatus for die-stamping of cardboard blanks used in production of packaging trays, and a process for operating such apparatus. The apparatus includes a dimensionally adjustable die having a plurality of separate movable parts each coupled to threaded adjustment rods and drive motors; a programmable control is coupled to the drive equipment and can selectively adjust and lock the die parts to conform the die to any one of a plurality of cardboard blank formats. Plural air-operated lockable jacks coupled to movable members of a stamp are also provided, and the jacks operate to automatically adjust the stamp to conform to the selected dimensions of the die. The apparatus can accept plural magazines of cardboard blanks and a plurality of different blanks supplied successively; under program control, the apparatus can automatically change the dimensions of the die and stamp to conform to the desired dimensions of the finished tray.

대표청구항 ▼

A method for dimensionally adjusting a die-stamping assembly for forming cardboard packaging tray blanks, said blanks having a fixed thickness, said assembly including a first die-stamping member and a second die-stamping member, each member including separate adjustable and lockable parts, said fir

A method for dimensionally adjusting a die-stamping assembly for forming cardboard packaging tray blanks, said blanks having a fixed thickness, said assembly including a first die-stamping member and a second die-stamping member, each member including separate adjustable and lockable parts, said first die-stamping member being generally fixed and said second die-stamping member being axially slidably movable toward said first member, said method including the following steps: (a) moving said second die-stamping member into contact with said first die-stamping member; (b) retracting said parts of said first die-stamping member and said second die-stamping member to minimum reference point; (c) moving said parts of said second die-stamping member and simultaneously moving corresponding parts of said first die-stamping member until said first die-stamping member assumes a desired dimension; (d) moving said parts of said first die-stamping member away from said second die-stamping member until said first die-stamping member is separated from said second die-stamping member by a space equal to said thickness; and (e) locking said parts of both said first and second die-stamping members; (f) moving said second die-stamping member away from said first die-stamping member.