초록 ▼

A low-density nonwoven abrasive pad, especially suited for use as a scouring article, formed of a multiplicity of continuous, crimped thermoplastic organic filaments having one end of substantially all of the filaments bonded together at one end of the pad and the opposite end of substantially all o

A low-density nonwoven abrasive pad, especially suited for use as a scouring article, formed of a multiplicity of continuous, crimped thermoplastic organic filaments having one end of substantially all of the filaments bonded together at one end of the pad and the opposite end of substantially all of the filaments bonded together at the opposite end of the pad. The abrasive pad is made by arranging the filaments into an open lofty array, bonding substantially all of the filaments together at a first and second bond site, and then cutting the array at the bond sites such that each bond is divided into at least two bond area segments with each bond area segment having the filament array bonded therein in a unitary structure.

대표청구항 ▼

A method of making a scouring article, comprising the steps of: (a) arranging a multiplicity of continuous, crimped or undulated, thermoplastic, organic filaments into an open lofty array with one point of each filament in said array corresponding to a first filament bonding site and a second point

A method of making a scouring article, comprising the steps of: (a) arranging a multiplicity of continuous, crimped or undulated, thermoplastic, organic filaments into an open lofty array with one point of each filament in said array corresponding to a first filament bonding site and a second point of each filament, distant from said first point, corresponding to a second filament bonding site; (b) bonding substantially all of said thermoplastic organic filaments together at said first and said second bonding sites to respectively provide a first bond area comprising bonded filaments and a second bond area comprising bonded filaments, said bond areas being of a size sufficient to permit division thereof into at least two bond area segments per bond area with each bond area segment having said filament array bonded therein in a unitary structure; and (c) dividing each of said first and said second bond areas into at least two bond area segments, each bond area segment having said filament array bonded therein in a unitary structure, by cutting said filament array within said bond areas to provide an open, lofty, nonwoven pad.