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A method of processing an orifice in a structure to attain a precise predetermined flow resistance through said orifice. Undersized orifices are machined by either electrochemical, chemical or electric discharge machining, while oversized orifices are electroplated, electroless plated or vapor depos

A method of processing an orifice in a structure to attain a precise predetermined flow resistance through said orifice. Undersized orifices are machined by either electrochemical, chemical or electric discharge machining, while oversized orifices are electroplated, electroless plated or vapor deposition coated, such that the processing fluid, i.e. the electrolyte, corrosive fluid, dielectric or carrier gas as used in the machining, plating or coating process is passed through said orifice during said processing at a predetermined fixed pressure while measuring the dynamic flow resistance of said processing fluid through said orifice until said dynamic flow resistance is equal to that desired.

대표청구항 ▼

The method of attaining a specific flow resistance of a fluid through an orifice in a structure by processing said orifice with a process utilizing a processing fluid, said process selected from the group consisting of chemical machining, electrochemical machining, electrical discharge machining, el

The method of attaining a specific flow resistance of a fluid through an orifice in a structure by processing said orifice with a process utilizing a processing fluid, said process selected from the group consisting of chemical machining, electrochemical machining, electrical discharge machining, electroplating, electroless plating and vapor deposition, wherein said processing fluid is caused to flow through said orifice by a mechanical pump, said method comprising: A. Determining a target flow resistance of said processing fluid at a constant applied pressure as will provide said specific flow resistance of said fluid; B. Pumping said processing fluid through said orifice with said mechanical pump to process said orifice while maintaining said constant applied pressure with said mechanical pump; C. Measuring the dynamic flow resistance of said processing fluid through said orifice while said processing fluid is being pumped therethrough, and permitting the volumetric flow rate of said processing fluid to change in direct proportion to the processing effected on said orifice for the purpose of maintaining said constant applied pressure with said pump; and D. Stopping the processing of said orifice when said dynamic flow resistance is equal to said target flow resistance.