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Low pressure high heat transfer fluid heat exchanger 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-013/08
출원번호 US-0511163 (1990-04-19)
발명자 / 주소
  • Nelson Richard D. (Austin TX) Herrell Dennis J. (Austin TX)
출원인 / 주소
  • Microelectronics And Computer Technology Corporation (Austin TX 02)
인용정보 피인용 횟수 : 37  인용 특허 : 11

초록

A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet

대표청구항

A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component and having first and second opposing ends, a fluid inlet at the first end and a fluid outlet at the second end, a plurality of spaced fins connected to the b

이 특허에 인용된 특허 (11)

  1. Vogel Xaver (Turgi CHX), Cooling body for the liquid cooling of high-power semiconductor components.
  2. Grasso Giacomo (Moncalieri ITX), Gas-liquid heat exchanger.
  3. Friedman Irwin R. (La Crosse WI) Foust Harry D. (Winona WI) Butt Alan G. (La Crosse WI), Heat exchanger having uniform surface temperature and improved structural strength.
  4. Perkins ; Calvin C., Heat exchanger structure for electronic apparatus.
  5. Pease Roger F. (Stanford CA) Tuckerman David B. (Stanford CA) Swanson Richard M. (Los Altos CA), Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like.
  6. Andrews D. Marshall (Satellite Beach FL), High density packaging technique for electronic systems.
  7. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard Chao-Fan (Poughkeepsie NY) Simmons Robert E. (Poughkeepsie NY), Immersion cooled circuit module with improved fins.
  8. Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits.
  9. Wachendorfer ; Sr. Paul L. (1 Hollacher Dr. Northport ; Long Island NY 11768), Method of making a monolithic refractory recuperator.
  10. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Staggered radial-fin heat sink device for integrated circuit package.
  11. Hsiao Wen-Ting (San Jose CA) Everling Hubertus A. (San Jose CA), Wafer scale integrated circuit testing chuck.

이 특허를 인용한 특허 (37)

  1. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  2. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  3. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  4. Jurgen Schulz-Harder DE, Cooler.
  5. Gerlach, David W., Cooling device and method with synthetic jet actuator.
  6. Barsun, Stephan Karl; Barr, Andrew Harvey; Dobbs, Robert William, Cooling device having fins arranged to funnel air.
  7. Gerard MacManus GB; Bruce Fryers GB; Nicholas Foley GB; Michael Tate GB, Cooling devices.
  8. Fryers Bruce,GBX ; MacManus Gerard,GBX ; Tate Michael,GBX ; Foley Nicholas,GBX, Cooling equipment.
  9. Busch, Klaus; Scharf, Christian; Wiesner, Christoph, Cooling facility for cooling a component.
  10. Asakura, Ken, Cooling structure for electric device.
  11. Kharazmi, Saeid, Electrical circuit component carrier.
  12. Kodaira Yuichi,JPX ; Ogawara Toshiki,JPX ; Kodama Nobumasa,JPX, Electronic component cooling apparatus.
  13. Kodama Nobumasa (Ueda JPX) Ogawara Toshiki (Chiisagata-gun JPX), Electronic component cooling apparatus.
  14. Root, Thatcher W., Extended-range heat transfer fluid using variable composition.
  15. Smith Randall (Georgetown TX) Mills R. Steven (Austin TX), For use with a heatsink a shroud having a varying cross-sectional area.
  16. Smith, Grant M.; Wessel, Mark W., Forced convection heat sink system with fluid vector control.
  17. Colling, Morgan, Heat exchanger.
  18. Gurevich Alex,ILX ; Khurin Ilya,ILX ; Bromberg Yuval,ILX, Heat radiating element.
  19. Roberts, John H.; Goss, Ronald David; Sondermeyer, Jack C., Heat sink alignment.
  20. Malone, Christopher G.; Abbott, Ryan, Heat sink apparatus with air duct.
  21. William J. Miller ; Imran A. Bhutta, Heat sink for use in cooling an integrated circuit.
  22. North, Mark T.; Koffs, Steven E., Heat sink with converging device.
  23. Lin, Wei; Nguyen, Son V.; Skordas, Spyridon; Vo, Tuan A., Liquid cooling of semiconductor chips utilizing small scale structures.
  24. Kolb, Gunther; Tiemann, David, Micro-evaporator.
  25. Vetrovec, Jan; Tran, Tri H., Microchannel heat exchanger.
  26. Lee,Poh Seng; Garimella,Suresh V., Microchannel heat sink.
  27. Palan Donald F., Microwave level gauge having an adapter with a thermal barrier.
  28. Materna, Peter Albert, Optimized fins for convective heat transfer.
  29. Materna,Peter A., Optimized fins for convective heat transfer.
  30. Hofmann,Wilfried, Refrigeration device and a method for producing the same.
  31. Gentry Cecil C. (Bartlesville OK), Rod baffle heat exchangers utilizing dual support strip.
  32. Gohara, Hiromichi, Semiconductor device and cooler thereof.
  33. Lin, Wei; Nguyen, Son V.; Skordas, Spyridon; Vo, Tuan A., Semiconductor package with structures for cooling fluid retention.
  34. Sugahara, Hiroto, Substrate mounted with electronic element thereon.
  35. Sugahara,Hiroto, Substrate mounted with electronic element thereon and liquid ejection head including the substrate.
  36. Nguyen, Andrew; Cheng, Wing Lau; Hanawa, Hiroji; Kats, Semyon; Ramaswamy, Kartik; Ye, Yan; Wong, Kwok Manus; Hoffman, Daniel J.; Ishikawa, Tetsuya; Lue, Brian C., Substrate support having fluid channel.
  37. Qu, Weilin, Two-phase cross-connected micro-channel heat sink.
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