초록 ▼

An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a b

An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a base member of the package. In one embodiment, a singular heat sink member is thermally coupled to a respective one of the semiconductor devices, and a common, second heat sink member is thermally coupled to all of the first heat sink members. This common heat sink member also uniquely serves as a stiffener for the package. In another embodiment, a common heat sink member is securedly positioned on the opposite side of a first circuitized substrate from the plurality of flexible circuitized substrates and semiconductor devices. A base member is also used as part of this package. As in the aforementioned other embodiment, the common heat sink member also serves as a stiffener.

대표청구항 ▼

An electronic package comprising: a base member; a first circuitized substrate secured to said base member; at least two semiconductor devices electrically coupled to said first circuitized substrate; at least two flexible circuitized substrates, each of said flexible circuitized substrates electric

An electronic package comprising: a base member; a first circuitized substrate secured to said base member; at least two semiconductor devices electrically coupled to said first circuitized substrate; at least two flexible circuitized substrates, each of said flexible circuitized substrates electrically connected to said first circuitized substrate and to a respective one of said semiconductor devices to provide said electrical coupling to said first circuitized substrate; at least two first heat sink members, each of said first heat sink members thermally coupled to a respective one of said semiconductor devices; and a second, common heat sink member thermally coupled to each of said first heat sink members, said first and second heat sink members providing a path for heat removal for each of said semiconductor devices during operation thereof, said common heat sink member also functioning as a stiffener member for said base member and said first circuitized substrate.