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Microencapsulated phase change material slurry heat sinks 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-020/00
  • H01L-023/44
  • H01L-023/473
출원번호 US-0357719 (1989-05-26)
발명자 / 주소
  • Sengupta Subrata (Coral Gables FL)
출원인 / 주소
  • University of Miami (Coral Gables FL 02)
인용정보 피인용 횟수 : 76  인용 특허 : 2

초록

A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electro

대표청구항

A heat sink device comprising: a sealed container; and a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.

이 특허에 인용된 특허 (2)

  1. Takahashi Yoshio (Urawa JPX) Ozawa Takeo (Ibaraki JPX) Sakamoto Ryuji (Kashiwa JPX) Kanari Katsuhiko (Ibaraki JPX) Kamimoto Masayuki (Ibaraki JPX), Heat storage medium for latent heat thermal energy storage unit.
  2. Colvin David P. (Apex NC) Mulligan James C. (Raleigh NC), Thermal energy storage apparatus using encapsulated phase change material.

이 특허를 인용한 특허 (76)

  1. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  2. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  3. Pal Debabrata ; McDunn Kevin, Apparatus including a heat-dissipating apparatus, and method for forming same.
  4. Freeland Mark, Bonding material and phase change material system for heat burst dissipation.
  5. Hartmann, Mark H.; Worley, James B.; North, Matthew, Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof.
  6. Hartmann, Mark; Worley, James Brice; North, Matthew, Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof.
  7. Hartmann, Mark; Worley, James Brice; North, Matthew, Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof.
  8. Hartmann,Mark Henry; Worley,James Brice, Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof.
  9. Worley,James Brice; Hartmann,Mark Henry; Lekan,Alan John; Magill,Monte Christopher; Henshaw,Michael Alan; Pushaw,Robert John, Coated articles having enhanced reversible thermal properties and exhibiting improved flexibility, softness, air permeability, or water vapor transport properties.
  10. Bannari, Abdelfettah, Compressed air energy storage and recovery.
  11. Weber, Richard M.; Rummel, Kerrin A., Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media.
  12. Nishii,Mikito; Arai,Hiroyuki; Sakai,Tsutomu; Kondo,Mitsuru, Coolant and cooling system.
  13. Langari, Abdolreza; Hashemi, Seyed Hassan, Cooling system for pulsed power electronics.
  14. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
  15. Dong, Xiaopeng; MacDonald, Mark, Device and method for mitigating radio frequency interference.
  16. Minamio, Masanori; Ikeuchi, Hiroki, Electrical component resin, semiconductor device, and substrate.
  17. Ke, Huang-Cheng; Chen, Hua-Feng, Electronic device with phase change material microcapsule layer.
  18. Oxley, James D.; Mathur, Anoop Kumar, Encapsulation of high temperature molten salts.
  19. Kaler, Jr., George Michael, Evaporative cooling system and device.
  20. Gordon Kerry W., Heat absorber and combination electrical apparatus producing heat and heat absorber.
  21. Carmine Persiani ; James A. Clarke, Heat absorbing surface coating.
  22. Zuo, Jon; Ernst, Donald M., Heat pipe having a wick structure containing phase change materials.
  23. Quintero, Lirio; Monteiro, Othon Rego, Heat removal in drilling and production operations.
  24. Quintero, Lirio; Monteiro, Othon Rego, Heat removal in drilling and production operations.
  25. Pidwerbecki, David; Uan-Zo-li, Alexander B., High heat capacity electronic components and methods for fabricating.
  26. Elias,J. Michael; Cepas,Bruce M.; Korn,James A., Integrated power and cooling architecture.
  27. Fitch John Stuart ; Hamburgen William Riis, Lap-top enclosure having surface coated with heat-absorbing phase-change material.
  28. Gaiser, Gerd, Latent heat storage device and associated manufacturing method.
  29. Kehl,Kenyon; Phielix,Tom J.; Cronin,William A., Liquid cooled electronic chassis having a plurality of phase change material reservoirs.
  30. Hartmann, Mark Henry; Magill, Monte Christopher, Melt spinable concentrate pellets having enhanced reversible thermal properties.
  31. Elias, J. Michael; Cepas, Bruce M., Method and apparatus for absorbing thermal energy.
  32. Holmberg Ulf I.,SEX ; Gudmundsson Bjorn,SEX, Method and apparatus for arranging heat transport.
  33. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
  34. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
  35. Jairazbhoy Vivek Amir ; Todd Michael George ; Reddy Prathap Amerwai, Method for cooling electronic components.
  36. Chomard,Ang��le; Argillier,Jean Fran��ois; Hipeaux,Jean Claude, Method for making a quasi-incompressible phase-change material, shear-thinned and with low heat conductivity.
  37. Searls,Damion T.; Dishongh,Terrance J.; Pullen,David, Method for passive phase change thermal management.
  38. Dudis, Douglas S.; Schmidt, Joel E.; Miller, Douglas J., Method for thermal management through use of ammonium carbamate.
  39. Farid, Mohammed Mehdi; Al-Hallaj, Said, Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling.
  40. Amrhein, Patrick; Spannagel, Albert; Ascherl, Hermann; Lang-Wittkowski, Gabriele, Microscapsule powder.
  41. Jack Herbert Hollister ; Mark Steven Zediker, Modularized fiber optic laser system and associated optical amplification modules.
  42. Magill, Monte C.; Hartmann, Mark H.; Haggard, Jeffrey S., Multi-component fibers having enhanced reversible thermal properties.
  43. Magill, Monte C.; Hartmann, Mark H.; Haggard, Jeffrey S.; Brang, James E., Multi-component fibers having enhanced reversible thermal properties.
  44. Hartmann, Mark; Haggard, Jeffrey S.; Magill, Monte Christopher; Brang, James E., Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof.
  45. Magill, Monte C.; Hartmann, Mark H.; Haggard, Jeffrey S., Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof.
  46. Magill,Monte C.; Hartmann,Mark H.; Haggard,Jeffrey S., Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof.
  47. Magill,Monte C.; Hartmann,Mark H.; Haggard,Jeffrey S., Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof.
  48. Leslie A. Momoda ; Amanda C. Phelps, Nanometer sized phase change materials for enhanced heat transfer fluid performance.
  49. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  50. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  51. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  52. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  53. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  54. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  55. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  56. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  57. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  58. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  59. Peterson, Bruce W.; Crawford, Mark L., Polyurethane gel particles, methods and use in flexible foams.
  60. Oberlin,Gary E.; Myers,Bruce A.; Degenkolb,Thomas A.; Peugh,Darrel E., Power electronic system with passive cooling.
  61. Patton, Claire Jean, Segmented liner system with microencapsulated phase change material.
  62. Foxenland, Eral, Self-cooling electrical device.
  63. Im, Yunhyeok; Park, Kyol; Cho, Taeje, Semiconductor packages.
  64. Tran, Bao, Smart building systems and methods.
  65. Tran, Bao Q., Smart building systems and methods.
  66. Hartmann, Mark H., Stable phase change materials for use in temperature regulating synthetic fibers, fabrics and textiles.
  67. Maxik, Fredric S.; Henderson, David; Bastien, Valerie, System for dissipating heat energy.
  68. Dudis, Douglas S.; Schmidt, Joel E.; Miller, Douglas J., Systems and methods for thermal management through use of ammonium carbamate.
  69. MacDonald, Mark, Techniques for computing device cooling using a self-pumping fluid.
  70. Chang, Kuang-Yu; Chiou, Ing-Jer, Thermal buffering element.
  71. Mathur, Anoop Kumar; Kasetty, Rajan Babu; Oxley, James D., Thermal energy storage system comprising encapsulated phase change material.
  72. Kim, Gerald Ho; Kim, Jay Eunjae, Thermal energy storage with a phase-change material in a non-metal container.
  73. Kim, Gerald Ho; Kim, Jay Eunjae, Thermal energy storage with a phase-change material in a non-metal container.
  74. Myers,Bruce A.; Chaudhuri,Arun K., Thermal transient suppression material and method of production.
  75. Myers, Bruce A.; Chaudhuri, Arun K.; Burns, Jeffrey H., Thermally-capacitive phase change encapsulant for electronic devices.
  76. Hsiao, Feng-Neng; Huang, Meng-Cheng, Three-phase heat transfer structure.
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