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Thermal protection method for a power device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/36
출원번호 US-0438382 (1989-11-20)
발명자 / 주소
  • Davies Robert B. (Tempe AZ) Jarrett Robert B. (Tempe AZ)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 50  인용 특허 : 10

초록 ▼

A thermally protected power transistor comprising a first chip which includes a power transistor and a second chip which includes protection circuitry. The second chip has a plurality of metallic bumps formed thereon which are coupled to various portions of the protection circuitry, wherein at least

대표청구항 ▼

A thermally protected switch comprising: a first chip having the switch formed thereon and having an electrode wherein the switch is on when a control signal is present on the electrode; and a second chip having control circuitry formed on a top side, the control circuitry further comprising a tempe

이 특허에 인용된 특허 (10)

  1. Satoh Ryohei (Yokohama JPX) Oshima Muneo (Yokohama JPX) Tanaka Minoru (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX) Murata Akira (Tokyo JPX) Hirota Kazuo (Chigasaki JPX), Electronic circuit device and method of producing the same.
    상세보기
  2. Tihanyi Jenoe (Munich DEX) Bierlmaier Johann (Munich DEX), MOSFET with temperature protection.
    상세보기
  3. Hasegawa Hitoshi (Tama JPX), Method for producing a semiconductor device.
    상세보기
  4. Pammer Erich (Taufkirchen DEX) Bischofberger Otfried (Munich DEX), Method for the galvanic manufacture of metallic bump-like lead contacts.
    상세보기
  5. Nakata Josuke (Itami JPX) Kameda Tohru (Itami JPX), Semiconductor device with a thermal protective device.
    상세보기
  6. Sawai Masaaki (Takasaki JPX), Semiconductor laser module having an improved temperature control arrangement.
    상세보기
  7. Schelhorn, Robert L., Structure for mounting a semiconductor chip to a metal core substrate.
    상세보기
  8. Yoshikawa Shoji (Tokyo JPX), Temperature control device for a semiconductor laser.
    상세보기
  9. Watanabe Hideo (Kanagawa JPX), Temperature controller for semiconductor device.
    상세보기
  10. Jenkins James O. M. (Swansea GBX), Temperature sensing apparatus.
    상세보기

이 특허를 인용한 특허 (50)

  1. Nobutaka Nishigaki JP, Apparatus for controlling internal heat generating circuit.
    상세보기
  2. Silverbrook, Kia; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Assembly of electronic components.
    상세보기
  3. Martinez Roberto ; Cheah Chuan, Co-packaged MOS-gated device and control integrated circuit.
    상세보기
  4. Gronwald, Frank; Lietz, Franz-Josef, Coated motor vehicle battery sensor element and method for producing a motor vehicle battery sensor element.
    상세보기
  5. James M. Wark, Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  6. Wark James M., Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  7. Wark James M., Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  8. Wark James M., Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  9. Otremba,Ralf, Electronic component and method for its assembly.
    상세보기
  10. Williams, Susan; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Electronic component with wire bonds in low modulus fill encapsulant.
    상세보기
  11. Silverbrook, Kia; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards.
    상세보기
  12. Pricer Wilbur ; Goodnow Kenneth Joseph ; Michail Michel S. ; Patel Janak Ghanshyambhai ; Ventrone Sebastian T., Integrated hot spot detector for design, analysis, and control.
    상세보기
  13. Zommer Nathan, Isolated multi-chip devices.
    상세보기
  14. Qualich John R., Loss-less load current sensing driver and method therefor.
    상세보기
  15. Nishigaki,Nobutaka; Ninomiya,Ryoji; Sakai,Makoto, Method and apparatus for controlling internal heat generating circuit.
    상세보기
  16. Duvvury Charvaka, Method and system for protecting integrated circuits against a variety of transients.
    상세보기
  17. Silverbrook, Kia; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Method of adhering wire bond loops to reduce loop height.
    상세보기
  18. Chung Long Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Method of applying encapsulant to wire bonds.
    상세보기
  19. Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Method of encapsulating wire bonds.
    상세보기
  20. Ball,Michael B., Method of fabricating a multi-die semiconductor package assembly.
    상세보기
  21. Mongan Ryan H., Method of junction temperature determination and control utilizing heat flow.
    상세보기
  22. Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Method of wire bond encapsulation profiling.
    상세보기
  23. Silverbrook, Kia; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Method of wire bonding an integrated circuit die and a printed circuit board.
    상세보기
  24. Wark, James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  25. Wark, James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  26. Wark, James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  27. Wark, James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  28. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  29. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  30. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  31. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  32. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  33. Wark,James M., Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice.
    상세보기
  34. Brown, David R, Modular orthopedic implant.
    상세보기
  35. Brauchle Peter (Nehren DEX) Uebele Manfred (Reutlingen DEX), Monolithically integrated mos output-stage component having an excess-temperature protection device.
    상세보기
  36. Davies, Robert Bruce, Power semiconductor device and method therefor.
    상세보기
  37. Davies, Robert Bruce, Power semiconductor device and method therefor.
    상세보기
  38. Davies, Robert Bruce, Power semiconductor device and method therefor.
    상세보기
  39. Davies, Robert Bruce, Power semiconductor device and method therefor.
    상세보기
  40. Davies, Robert Bruce, Power semiconductor device and method therefor.
    상세보기
  41. Moline, Dan, RF power transistor having an encapsulated chip package.
    상세보기
  42. Davies, Robert Bruce, Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure.
    상세보기
  43. Moline, Daniel D., Semiconductor component.
    상세보기
  44. Pavio,Jeanne S., Semiconductor component and method of manufacture.
    상세보기
  45. Guo,Sam Y, Solid state switch with quasi-predictive short circuit protection and thermal protection.
    상세보기
  46. Torrisi, Giovanni Luca; Porto, Domenico Massimo; Lecce, Sergio; Gaertner, Manuel, Thermal control process for a multi-junction electronic power device and corresponding electronic power device.
    상세보기
  47. Porto, Domenico Massimo; Torrisi, Giovanni Luca; Gaertner, Manuel; Lecce, Sergio, Thermal control process for a multijunction electronic power device and corresponding electronic power device.
    상세보기
  48. Lee, Min-Woo; Jang, Kyung-Oun; Cho, Dae-Woong, Thermal shutdown unit, switch controller including the same, and control method of thermal shutdown protection operation.
    상세보기
  49. Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Wire bond encapsulant application control.
    상세보기
  50. Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Wire bond encapsulant control method.
    상세보기

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