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Zero power IC module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/00
출원번호 US-0531150 (1990-06-06)
발명자 / 주소
  • Queyssac Daniel (Dallas TX)
출원인 / 주소
  • SGS-Thomson Microelectronics, Inc. (Carrollton TX 02)
인용정보 피인용 횟수 : 37  인용 특허 : 2

초록

An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a finger lead assembly encapsulated within a body of non-conductive material, with a coplanar base support finger lead traversing

대표청구항

A device package for providing electrical power to an electronic circuit device comprising, in combination: a body of non-conductive material; a finger lead assembly encapsulated within said body of non-conductive material, said finger lead assembly including a plurality of conductive finger leads,

이 특허에 인용된 특허 (2)

  1. Kuwabara Michiaki (Tokyo JPX) Hayashi Hiromasa (Kamakura JPX), IC socket having a backup power cell and circuit.
  2. Miyauchi, Katsuki; Kudo, Tetsuichi; Minato, Osamu; Masuhara, Toshiaki; Uetani, Yoshio, Semiconductor integrated circuit.

이 특허를 인용한 특허 (37)

  1. Jacobs, Harlan T.; Jenson, Mark L.; Klassen, Jody J.; Yan, Jenn-Feng, Battery-operated wireless-communication apparatus and method.
  2. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  3. Morrison, Timothy J.; Gutierrez, Aurelio J.; Rascon, Thomas, Electronic packaging device with insertable leads and method of manufacturing.
  4. Larson Erik N. ; Candelore Brant, Integrated circuit carrier package with battery coin cell.
  5. Youssef Tom ; McClure David Charles, Integrated circuit for switching from power supply to battery, integrated latch lock, and associated method for same.
  6. Hundt, Michael J.; Du, Haibin; Kelappan, Krishnan; Sigmund, Frank, Integrated circuit package including embedded thin-film battery.
  7. Hundt, Michael J.; Du, Haibin; Kelappan, Krishnan; Sigmund, Frank, Integrated circuit package including embedded thin-film battery.
  8. McCain,Joseph, Integrated circuit package with laminated power cell having coplanar electrode.
  9. Li, Wu Hu; Wagiman, Mohamad Yazid; Low, Min Wee, Leadframe, semiconductor package and support lead for bonding with groundwires.
  10. Jenson, Mark L.; Klaassen, Jody J., Method and apparatus for integrated-circuit battery devices.
  11. Jenson, Mark L.; Klaassen, Jody J., Method and apparatus for integrated-circuit battery devices.
  12. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  13. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  14. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  15. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  16. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  17. Tuttle, Mark E.; Tuttle, John R.; Lake, Rickie C., Method of manufacturing an enclosed transceiver.
  18. Morrison, Timothy J.; Gutierrez, Aurelio J.; Rascon, Thomas, Method of manufacturing electronic packaging device with insertable leads.
  19. Tuttle,Mark E.; Lake,Rickie C., Methods for forming integrated circuits within substrates.
  20. McCain, Joseph H., Microelectronic device with integrated energy source.
  21. McCain, Joseph H., Microelectronic device with integrated energy source.
  22. Tuttle John R., Miniature Radio Frequency Transceiver.
  23. Ikeda Tatsuo (Suwa JPX) Ogiso Hiroyuki (Suwa JPX) Ichinose Kazushige (Suwa JPX), Piezoelectric oscillator including a piezoelectric resonator with outer lead.
  24. Tuttle, John R., Radio frequency identification device and method.
  25. Tuttle, John R., Radio frequency identification device and method.
  26. Tuttle, John R., Radio frequency identification device and method.
  27. James P. Nuxoll ; Steven L. Hamren, Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices.
  28. James P. Nuxoll ; Steven L. Hamren, Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices.
  29. Nuxoll James P. ; Hamren Steven L., Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices.
  30. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  31. McCabe Arthur Barney ; Tuttle John R. ; Wood ; Jr. Clifton W., Tamper resistant smart card and method of protecting data in a smart card.
  32. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
  33. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
  34. Tuttle,John R., Thin flexible, RFID labels, and method and apparatus for use.
  35. Tuttle,John R., Thin, flexible, RFID label and system for use.
  36. O'Brien, Richard J.; Day, John K.; Gerrish, Paul F.; Mattes, Michael F.; Ruben, David A.; Grief, Malcolm K., Wafer-scale package including power source.
  37. O'Brien, Richard J; Day, John K; Gerrish, Paul F; Mattes, Michael F; Ruben, David A; Grief, Malcolm K, Wafer-scale package including power source.
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