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Metal material with film passivated by fluorination and apparatus composed of the metal material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-020/06
출원번호 US-0381914 (1989-07-19)
우선권정보 JP-0181225 (1988-07-20); JP-0006892 (1989-01-13)
발명자 / 주소
  • Ohmi Tadahiro (2-1-17-302
  • Komegafukuro Sendai-shi
  • Miyagi-ken JPX) Miki Masahiro (23-14-521
  • Tezukayama 1-Chome Abeno-ku
  • Osaka JPX) Kikuyama Hirohisa (7-13
  • 3-Cho
  • Ayameike Kita Nara-shi
  • Na
인용정보 피인용 횟수 : 48  인용 특허 : 1

초록

A metal material characterized in that a film passivated by fluorination which is mainly composed of a metal fluoride substantially satisfying stoichiometric ratio is formed at least partially on a surface of a metal of the metal material, and an apparatus at least partially composed of the metal ma

대표청구항

A metal material comprising a metal substrate, and a passivated film formed on at least a portion of the surface of the metal substrate by fluorination of the metal substrate, said film being composed mainly of a metal fluoride in which the proportion of metal to fluorine is substantially in stoichi

이 특허에 인용된 특허 (1)

  1. Tarancon Gregorio (Woodbridge NJ), Halogenation treatment.

이 특허를 인용한 특허 (48)

  1. Chen, Xin; Aswath, Pranesh B.; Elsenbaumer, Ronald L., Alkylphosphorofluoridothioates having low wear volume and methods for synthesizing and using same.
  2. Klawuhn, Erich R.; Rozbicki, Robert; Dixit, Girish A., Apparatus and methods for deposition and/or etch selectivity.
  3. Klawuhn,Erich R.; Rozbicki,Robert; Dixit,Girish A., Apparatus and methods for deposition and/or etch selectivity.
  4. Heyse, John V.; Mulaskey, Bernard F.; Innes, Robert A.; Hagewiesche, Daniel P.; Hubred, Gale L.; Moore, Steven C.; Bryan, Paul F.; Hise, Robert L.; Trumbull, Steven E.; Harris, Randall J., Apparatus for hydrocarbon processing.
  5. Pradhan, Anshu A.; Rozbicki, Robert, Atomic layer profiling of diffusion barrier and metal seed layers.
  6. Pradhan, Anshu A.; Rozbicki, Robert, Atomic layer profiling of diffusion barrier and metal seed layers.
  7. Toyoda Yoshihiko,JPX ; Fukada Tetsuo,JPX ; Mori Takeshi,JPX ; Hasegawa Makiko,JPX, CVD apparatus for Cu formation.
  8. F. Conrad Greer, Catalyzed compositions and methods for use in vehicle surface anti-icing and other applications.
  9. Greer F. Conrad, Catalyzed lubricant additives and catalyzed lubricant systems designed to accelerate the lubricant bonding reaction.
  10. Greer F. Conrad, Catalyzed surface composition altering and surface coating formulations and methods.
  11. Shaviv, Roey; Gopinath, Sanjay; Holverson, Peter; Pradhan, Anshu A., Conformal films on semiconductor substrates.
  12. Shaviv, Roey; Gopinath, Sanjay; Holverson, Peter; Pradhan, Anshu A., Conformal films on semiconductor substrates.
  13. Heyse John V. ; Kunze Alan G., Cracking processes.
  14. Behm, Philip E.; McDermott, Wayne Thomas; Xiao, Manchao; Pearlstein, Ronald Martin; Lo, Sai-Hong A.; Derecskei-Kovacs, Agnes, Cylinder surface treated container for monochlorosilane.
  15. Wu, Hui-Jung; Juliano, Daniel R.; Wu, Wen; Dixit, Girish, Deposition of doped copper seed layers having improved reliability.
  16. Dulkin, Alexander; Vijayendran, Anil; Yu, Tom; Juliano, Daniel R., Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer.
  17. Ohmi Tadahiro,JPX ; Sano Naoto,JPX ; Shirai Yasuyuki,JPX, Discharge electrode, shape-restoration thereof, excimer laser oscillator, and stepper.
  18. Nakao, Kiyoharu; Nara, Hisashi; Yoshioka, Shunsuke, Excimer laser device.
  19. Ohmi Tadahiro,JPX ; Shirai Yasuyuki,JPX ; Sano Naoto,JPX, Excimer laser generator provided with a laser chamber with a fluoride passivated inner surface.
  20. Ohmi Tadahiro,JPX ; Tanaka Nobuyoshi,JPX, Excimer laser oscillation apparatus.
  21. Ohmi Tadahiro,JPX ; Tanaka Nobuyoshi,JPX ; Hirayama Masaki,JPX, Excimer laser oscillation apparatus and method, excimer laser exposure apparatus, and laser tube.
  22. Ohmi, Tadahiro; Osawa, Hiroshi; Tanaka, Nobuyoshi; Ino, Kazuhide; Shinohara, Toshikuni; Shirai, Yasuyuki; Hirayama, Masaki, Gas supply path structure for a gas laser.
  23. Heyse, John V.; Hagewiesche, Daniel P.; Spindler, Paul M., Increasing production in hydrocarbon conversion processes.
  24. Ohmi Tadahiro,JPX ; Chiba Kazuo,JPX ; Mikasa Yutaka,JPX ; Ishigaki Kenji,JPX ; Miki Nobuhiro,JPX ; Maeno Matagoro,JPX ; Kikuyama Hirohisa,JPX, Industrial material with fluorine passivated film and process of manufacturing the same.
  25. Watson, Tom A.; Sandstrom, Richard L.; Morton, Richard G.; Weeks, Robert E.; Quitter, John P.; Lewis, Mark R., Laser discharge chamber passivation by plasma.
  26. Watson, Tom A.; Sandstrom, Richard L.; Morton, Richard G.; Weeks, Robert E.; Quitter, John P.; Lewis, Mark R., Laser discharge chamber passivation by plasma.
  27. Ohmi Tadahiro,JPX ; Chiba Kazuo,JPX ; Kume Hideo,JPX ; Mikasa Yutaka,JPX ; Maeno Matagoro,JPX ; Nakagawa Yoshinori,JPX ; Izumi Hiroto,JPX ; Yamane Kazuhito,JPX, Metal material formed with fluorocarbon film, process for preparing the material and apparatus made with use of the mate.
  28. Ohmi Tadahiro,JPX ; Chiba Kazuo,JPX ; Kume Hideo,JPX ; Mikasa Yutaka,JPX ; Maeno Matagoro,JPX ; Nakagawa Yoshinori,JPX ; Izumi Hiroto,JPX ; Yamane Kazuhito,JPX, Metal material formed with fluorocarbon film, process for preparing the material and apparatus made with use of the material.
  29. Ohtani,Teruyuki; Tsuji,Makoto; Utsunomiya,Masao, Metal separator for fuel cell and production method therefor.
  30. Pradhan, Anshu A.; Hayden, Douglas B.; Kinder, Ronald L.; Dulkin, Alexander, Method and apparatus for increasing local plasma density in magnetically confined plasma.
  31. Danek, Michal; Rozbicki, Robert, Method for depositing a diffusion barrier for copper interconnect applications.
  32. Dennis L. Holtermann ; Hong Chiu Chen ; Richard M Wolpert ; Charles R. Wilson ; Daniel P. Hagewiesche, Method for removing reactive metal from a reactor system.
  33. Holtermann, Dennis L.; Chen, Hong Chiu; Wolpert, Richard M; Wilson, Charles R.; Hagewiesche, Daniel P., Method for removing reactive metal from a reactor system.
  34. Rozbicki, Robert T.; Danek, Michal; Klawuhn, Erich R., Method of depositing a diffusion barrier for copper interconnect applications.
  35. Rozbicki, Robert; Danek, Michal; Klawuhn, Erich, Method of depositing a diffusion barrier for copper interconnect applications.
  36. Rozbicki, Robert; Danek, Michal; Klawuhn, Erich, Method of depositing a diffusion barrier for copper interconnect applications.
  37. Dulkin, Alexander; Rairkar, Asit; Greer, Frank; Pradhan, Anshu A.; Rozbicki, Robert, Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer.
  38. Rozbicki, Robert, Methods and apparatus for resputtering process that improves barrier coverage.
  39. Rozbicki, Robert; van Schravendijk, Bart; Mountsier, Thomas; Wu, Wen, Multistep method of depositing metal seed layers.
  40. Rozbicki, Robert; van Schravendijk, Bart; Mountsier, Tom; Wu, Wen, Multistep method of depositing metal seed layers.
  41. Rozbicki, Robert T.; Powell, Ronald Allan; Klawuhn, Erich; Danek, Michal; Levy, Karl B.; Reid, Jonathan David; Khosla, Mukul; Broadbent, Eliot K., Passivation of copper in dual damascene metalization.
  42. Hobbs, John Peter; Hart, James Joseph, Plasma cleaning gas with lower global warming potential than SF6.
  43. Kailasam, Sridhar; Rozbicki, Robert; Yu, Chentao; Hayden, Douglas, Resputtering process for eliminating dielectric damage.
  44. Juliano, Daniel R., Selective resputtering of metal seed layers.
  45. Ohmi, Tadahiro; Kikuyama, Hirohisa; Miyashita, Masayuki; Izumi, Hiroto; Kujime, Takanobu, Stainless steel having passive fluoride film formed thereon and equipment manufactured therefrom.
  46. Kinouchi, Kouki; Kurokawa, Wataru; Shintani, Shouzou; Shintani, legal representative, Kinuyo; Imoda, Daisuke; Yoshihiro, Kenji; Yamamori, You, Stainless steel member for a fuel cell.
  47. Aswath, Pranesh; Chen, Xin; Sharma, Vibhu; Igartua, Maria Amaya; Pagano, Francesco; Binder, Wolfgang; Zare, Parvin; Doerr, Nicole, Synergistic mixtures of ionic liquids with other ionic liquids and/or with ashless thiophosphates for antiwear and/or friction reduction applications.
  48. Kinder, Ronald L.; Pradhan, Anshu A., Use of ultra-high magnetic fields in resputter and plasma etching.

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