초록 ▼

A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output ter

A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

대표청구항 ▼

A thermoelectrically cooled integrated circuit package comprising a thermally conductive dielectric substrate, an input connecting portion supported by said dielectric substrate, an output connecting portion supported by said dielectric substrate, and an integrated circuit chip including an input te

A thermoelectrically cooled integrated circuit package comprising a thermally conductive dielectric substrate, an input connecting portion supported by said dielectric substrate, an output connecting portion supported by said dielectric substrate, and an integrated circuit chip including an input terminal and an output terminal, said input terminal being electrically connected to said input connecting portion via a first conductive material, and said output terminal being electrically connected to said output connecting portion via a second conductive material said first conductive material and said second conductive material thermoelectrically cooling said integrated circuit chip when a signal passes through said first conductive material and said second conductive material.