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A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a

A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header. The interface between the further conductor pin and the header is configured to provide an effectively blind mated, matched impedance feed-through signal path, so as to facilitate attachment of the conductive cover to the header.

대표청구항 ▼

A multi-component antenna mounted to a vehicle structure comprising: a transmission line structure integrally supported with said vehicle structure; and a plurality of microwave signal processing/antenna modules supported adjacent to and coupled with said transmission line structure, each of said mi

A multi-component antenna mounted to a vehicle structure comprising: a transmission line structure integrally supported with said vehicle structure; and a plurality of microwave signal processing/antenna modules supported adjacent to and coupled with said transmission line structure, each of said microwave signal processing/antenna modules including a microwave circuit component carrier having a conductive support upon a generally planar surface of which a microwave integrated circuit component is mounted, said support having at least one aperture therethrough extending from an interior portion of said module whereat said microwave circuit component is mounted to an exterior portion of said module, a conductor element supported within and extending through a respective aperture in said conductive support, so as to form a transmission line therethrough between said interior portion of said module, whereat said microwave circuit component is mounted, and an exterior portion thereof, said conductor element being coupled to a portion of said transmission line structure, a cover engageable with said support and enclosing therewith a cavity within which said microwave circuit component is mounted on said conductive support, an antenna element supported on an outer surface of a top portion of said cover, said outer surface of said top portion of said cover being parallel to the generally planar surface of said conductive support upon which said microwave circuit component is mounted, said antenna element comprising a conductive layer extending parallel to said generally planar surface, so that the launch direction of an electromagnetic wave emitted by said antenna is orthogonal to said generally planar surface, first means, extending through said top portion of said cover, for providing a signal path from said microwave circuit component mounted within said cavity to said antenna element, and second means for providing a conductive path between said conductor element and said microwave circuit component mounted on said conductive support.