초록 ▼

Interconnected integrated circuits (16) packaged at a very high density are fabricated beginning with a plurality of substrates (50 or 400 or 500) where each substrate has metal edge contact sites (12 or 507). Several substrates are joined together in a stack (82 or 402 or 512) held together tightly

Interconnected integrated circuits (16) packaged at a very high density are fabricated beginning with a plurality of substrates (50 or 400 or 500) where each substrate has metal edge contact sites (12 or 507). Several substrates are joined together in a stack (82 or 402 or 512) held together tightly by bolts (62) or by a thermoplastic adhesive (510). An interconnect pattern (250 or 423) electrically connects integrated circuits (16) on different substrates. Defective substrates are removable from the stack for repair by removing the bolts or by heating the adhesive to soften it sufficiently to allow removal of the individual substrate. The interconnect pattern, which is removed whenever a substrate is replaced, is reapplied after the removed substrate has been replaced.

대표청구항 ▼

A stack of interconnected integrated circuits, comprising: a plurality of substrates in a stacked configuration, each of said substrates having an integrated circuit positioned thereof, respectively; electrical connecting means on each of said substrates, respectively, for providing electrical conne

A stack of interconnected integrated circuits, comprising: a plurality of substrates in a stacked configuration, each of said substrates having an integrated circuit positioned thereof, respectively; electrical connecting means on each of said substrates, respectively, for providing electrical connection sites on a side of said stacked configuration of said plurality of substrates, said electrical connection means on each of said substrates, respectively, being electrically connected to said integrated circuit positioned on each of said substrates, respectively; holding means for holding said substrates together in said stacked configuration; and interconnecting means comprising an insulative film laminated to said side of said stacked configuration of said plurality of substrates, and conductor means positioned on said insulative film and passing through via holes in said film to selected ones of said electrical connection sites for selectively interconnecting said selected ones of said sites.