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Flat cooling structure of integrated circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-025/04
출원번호 US-0349411 (1989-05-08)
우선권정보 JP-0113222 (1988-05-09); JP-0155523 (1988-06-22); JP-0253539 (1988-10-06); JP-0253540 (1988-10-06); JP-0058720 (1989-03-10)
발명자 / 주소
  • Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 52  인용 특허 : 53

초록

A circuit assembly with circulation of coolant. A plurality of chips of integrated circuit are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on the substrate and having a planar shape circulates coolant therethrough. The circulating unit has with

대표청구항

An integrated circuit cooling structure, comprising: a substrate; a plurality of integrated circuits arranged on said substrate; a cooling plate opposed in gap relation to the upper surfaces of said plurality of integrated circuits and formed with a plurality of cut cavities arranged in corresponden

이 특허에 인용된 특허 (53)

  1. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
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