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Epoxy composition and use thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/28
출원번호 US-0267406 (1988-11-04)
발명자 / 주소
  • Ameen Joseph G. (Apalachin NY) Funari Joseph (Vestal NY) Sammakia Bahgat G. (Johnson City NY) Sissenstein
  • Jr. David W. (Endwell NY) Smey Samuel L. (Binghamton NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 17  인용 특허 : 30

초록

A curable composition containing an epoxide component and zinc oxide and use thereof.

대표청구항 ▼

A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component cont

이 특허에 인용된 특허 (30)

  1. Kawabata Juheiji (Takaishi JPX) Sugie Toshinori (Takaishi JPX) Kobata Fumihiro (Izumi JPX) Hirayama Akira (Chiba JPX), Block copolymers and resin compositions.
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  2. Ambros, Peter; Gatzke, Erich, Bonding assistant for a support material.
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  3. Kaufman, Lance R., Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink.
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  4. Lin Shiow C. (Ellicott City MD), Conductive thermosetting compositions and process for using same.
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  5. Tamura Katsuhide (Soka JPX), Electro-optic display device and a method of producing the same.
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  6. Funari Joseph (Vestal NY) Green Mary C. (Endicott NY) Reynolds Scott D. (Endwell NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with improved heat sink.
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  7. Susko John R. (Vestal NY) Wheater Robin A. (Owego NY), Epoxy composition and sealing of integrated circuit modules therewith.
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  8. McCaskey Harold O. (Allendale SC) Benson Melvin E. (Varnville SC), Fire-resistant filler sheet laminates.
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  9. Schoenberg Andrew J. (Huntington NY) Friedrich Marju L. (Babylon NY), Heat activatable adhesive for wire scribed circuits.
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  10. Landi Vincent R. (Danielson CT) Fitts Bruce B. (Quinebaug CT), Heat stable phenolic composition containing aramid fibers.
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  11. Weidenbenner William A. (Dallas TX) Steltz Irvin J. (North Wales PA), Heat transfer composition and method of making.
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  12. Spaight ; Ronald Neil, Heat transfer mechanism for integrated circuit package.
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  13. Olson Larry D. (Viroqua WI), Hybrid woven glass cloths.
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  14. Schuessler Philipp W. H. (Endwell NY), Method for hermetically sealing an electronic circuit package.
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  15. Hallstrom James R. (Brookfield WI) Hoffman Raymond J. (Fox Point WI) Walling Ronald L. (Sussex WI), Method of applying a wearing surface.
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  16. Leibowitz Joseph D. (Culver City CA), Method of fabricating multilayer printed circuit board structure.
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  17. Fick Herbert J. (Northfield MN), Method of preparing interfacings of heat sinks with electrical devices.
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  18. Hesse Wolfgang (Taunusstein DEX) Rahut Klas (Wiesbaden DEX), Mixture for the production of acid-resistant sealing materials and impregnating materials, a process for their preparati.
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  19. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Mounting pad for solid-state devices.
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  20. Aakalu Nandakumar G. (Poughkeepsie NY) Rittmiller Lawrence A. (Saugerties NY), Non-bleeding thixotropic thermally conductive material.
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  21. Carnahan Robert D. (Barrington IL) Holt ; Jr. William C. (Alexandria VA) Youtsey Karl J. (Decatur AL), Polymeric materials containing semiconducting refractory oxides.
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  22. Irving Edward (Burwell GB2), Polymerizable compositions containing diphenyliodosyl salts.
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  23. Dolch Ronald G. (Budd Lake NJ) Kerr ; Jr. Robert N. (Reading PA), Pressure-sensitive antistatic adhesive and process for the preparation thereof using an aqueous latex copolymer and a qu.
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  24. Arachtingi James J. (Massapequa Park NY), Process for bonding metals to electrophoretically deposited resin coatings.
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  25. Imai ; Takeshi, Resin-sealed electrical device.
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  26. Perkins ; Jr. Francis W. (Princeton NJ) Chiu Shiu-Chu (San Diego CA) Parks Paul (San Diego CA) Rawls John M. (Del Mar CA), Resonant-cavity antenna for plasma heating.
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  27. Darrow Russell E. (Newark Valley NY) Memis Irving (Vestal NY) Poliak Richard M. (Endwell NY), Sealing of integrated circuit modules.
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  28. Balderes Demetrios (Wappingers Falls NY) Lynch John R. (Hopewell Junction NY) Yacavonis Robert A. (Poughkeepsie NY), Semiconductor package with improved conduction cooling structure.
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  29. Ibata Jyoji (Fuki JPX) Fukui Hisaaki (Nobeoka JPX) Yuasa Takeo (Fuji JPX) Katoh Michio (Fuji JPX), Sheet molding material produced by associating a layer comprising a photopolymerizable material with layers comprising t.
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  30. Leland John E. (Bartlesville OK) Dix James S. (Bartlesville OK) Shue Robert S. (Bartlesville OK), Zinc oxide in poly(arylene sulfide) compositions.
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  1. Fuller, Jr., James W.; Knight, Jeffrey A., Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method.
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  2. Nelson Daryl James, Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.
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  3. Sanftleben, Henry M.; Ferraro, Derek S., Electronic package and method therefor.
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  4. Lawton, Ernest L.; Rau, Robert B.; Puckett, Garry D., Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding.
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  5. Bruce E. Novich ; Kami Lammon-Hilinski ; Walter J. Robertson ; Xiang Wu ; Vedagiri Velpari ; Ernest L. Lawton ; William B. Rice, Impregnated glass fiber strands and products including the same.
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  6. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
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  7. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
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  8. Dosdos, S. Gabriel R.; Kim, Dong Wook, Integrated circuit package and method of forming an integrated circuit package.
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  9. Zohni, Nael; Nagarajan, Kumar; Boja, Ronilo, Integrated circuit packaging devices and methods.
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  10. King David R. (Elkton MD) Adler Gary C. (Newark DE) Korleski Joseph E. (Newark DE) Waters Michelle M. H. (Hockessin DE), Matched low dielectric constant, dimensionally stable adhesive sheet.
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  11. Brusic Vista A. ; Darekar Vijay S. ; Gaynes Michael A. ; Saraf Ravi F., Organic-metallic composite coating for copper surface protection.
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  12. Lawton, Ernest L.; Rau, Robert, Resin compatible yarn binder and uses thereof.
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  14. Ameen Joseph G. (Newark DE) Korleski Joseph E. (Newark DE) Mortimer ; Jr. William P. (Conowingo MD) Yokimcus Victor P. (Landenberg PA), Thermally conductive adhesive interface.
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  15. Bergerson Steven E., Thermally conductive filled polymer composites for mounting electronic devices and method of application.
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  16. Bergerson Steven E. (St. Louis Park MN), Thermally conductive interface for electronic devices.
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  17. Hanrahan James R., Thermally conductive polytetrafluoroethylene article.
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