초록 ▼

A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat o

A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of the semiconductor elements to the cooling medium is provided near the cooling elements and between the thermal conductor and a channel plate mounted on the thermal conductor.

대표청구항 ▼

A semiconductor cooling module for cooling semiconductor elements, comprising: a plurality of semiconductor elements mounted on a substrate; a cooling element mounted on each of said semiconductor elements for transferring heat generated from said semiconductor elements, each of the cooling elements

A semiconductor cooling module for cooling semiconductor elements, comprising: a plurality of semiconductor elements mounted on a substrate; a cooling element mounted on each of said semiconductor elements for transferring heat generated from said semiconductor elements, each of the cooling elements including a first, a second and a third side arranged so as to form a wedge, said first side of the respective cooling elements are disposed in contact with said semiconductor elements; a thermal conductor in contact with the second side of each of said cooling elements, said thermal conductor including a surface facing the third side of each cooling elements with a predetermined air gap therebetween and including a plurality of grooves for enabling a flow of a cooling medium along a surface of the thermal conductor opposite a surface in contact with the second side of said cooling elements, each groove being defined by the surface opposite the surface in contact with the second side of said cooling elements and the surface facing the third side of said cooling elements and extending in a longitudinal direction of the second side of each cooling element and a longitudinal direction of the third side of the cooling element; a compression spring inserted between said third side of each cooling element and said surface of said thermal conductor facing said third side; and a channel plate mounted directly on said thermal conductor for enabling a flow of said cooling medium.