초록 ▼

The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The

The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.

대표청구항 ▼

1. A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrically conductive washer for electrical interco

1. A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrically conductive washer for electrical interconnection to said semiconductor bridge device bonded and electrically interconnected to an interior surface of said sidewalls, said primer cup, primer button and electrically conductive washer individually selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys and iron-nickel alloys; a means selected from the group consisting of leadwires and TAB leads for electrically interconnecting said semiconductor bridge device to both said primer cup and to said primer button; and a dielectric material selected from the group consisting of polymers, ceramics and glasses disposed between said primer button and said primer cup. 2. The primer housing of claim 1 wherein said dielectric material is a polymer. 3. The primer housing of claim 2 wherein said dielectric material is an epoxy. 4. The primer housing of claim 2 wherein said primer button is selected from the group consisting of aluminum and aluminum alloys. 5. The primer housing of claim 4 wherein said semiconductor bridge device is bonded to said primer button in close proximity to an energetic charge by an electrically conductive die attach and electrically interconnected to both said primer cup and said primer button. 6. The primer housing of claim 2 wherein said semiconductor bridge device is bonded to said primer button in close proximity to an energetic charge by an electrically non-conductive die attach material and electrically interconnected to both said primer cup and said primer button.