초록 ▼

Wafer scale integrated circuit apparatus wherein a full wafer scale semiconductor integrated wafer is adhesively secured to an essentially flat heat conducting non-metallic base member with the wafer and base member having coefficients of thermal expansion approximately equal to one another. A cable

Wafer scale integrated circuit apparatus wherein a full wafer scale semiconductor integrated wafer is adhesively secured to an essentially flat heat conducting non-metallic base member with the wafer and base member having coefficients of thermal expansion approximately equal to one another. A cable adapter assembly connected to an edge of the base member secures one or more multiconductor flat cables in position such that the conductors thereof, by means of a clamping arrangement make positive pressure contacts with contact points connected to electronic circuitry of the semiconductor wafer. Another wafer may be placed on an opposed surface of the base member and a second cable adapter assembly may be utilized to secure another multiconductor flat cable for making interconnection between contact points of the wafer on one surface with contact points of the wafer on the opposed surface of the base member. The arrangement constitutes a wafer module and a plurality of such identical wafer modules may be stacked one upon the other and placed in a housing which has heat conducting side walls for heat dissipation purposes. A cable link assembly traverses the flat cables held in position by the first cable adapter assemblies of the wafer modules in order to serve for the inputting and outputting of electrical signals.

대표청구항 ▼

Wafer scale integrated circuit apparatus comprising: A) a semiconductor wafer having defined therein electronic circuitry for performing electronic functions; B) said semiconductor wafer including a plurality of contact points electrically connected to said electronic circuitry; C) an essentially fl

Wafer scale integrated circuit apparatus comprising: A) a semiconductor wafer having defined therein electronic circuitry for performing electronic functions; B) said semiconductor wafer including a plurality of contact points electrically connected to said electronic circuitry; C) an essentially flat, heat conducting base member having first and second surfaces; D) said semiconductor wafer being secured to said base member on said first surface thereof, said member being operable to not only support said semiconductor wafer but to conduct heat therefrom during operation; E) said semiconductor wafer and said base member having coefficients of thermal expansion approximately equal to one another; F) a multiconductor flat cable having predetermined conductors in electrical contact with predetermined ones of said contact points of said semiconductor wafer; G) a cable adapter assembly secured to said base member and operable to mechanically secure said flat cable in relation to said semiconductor wafer to insure said electrical contact of said conductors with said contact points; and H) another multiconductor flat cable held in position by said cable adapter assembly and extending over a portion of the surface of said semiconductor wafer and particularly over the electronic circuitry define therein and positioned to make electrical contact directly with said electronic circuitry.