초록 ▼

The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the

The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the solid solution at the interface between the substrate and the thick film copper and then applying the dielectric layer to the thick film copper and curing the dielectric layer. Circuit patterns and components can then be built on the dielectric layer.

대표청구항 ▼

A method of forming a glass type dielectric layer on a metallic substrate having an improved bond thereto comprising the steps of providing a base having an outer layer of copper, applying a layer of thick film copper comprising copper particles and glass frit on the outer layer of copper, curing th

A method of forming a glass type dielectric layer on a metallic substrate having an improved bond thereto comprising the steps of providing a base having an outer layer of copper, applying a layer of thick film copper comprising copper particles and glass frit on the outer layer of copper, curing the thick film copper in a nitrogen atmosphere thereby bonding the thick film copper to the base copper, coating the thick film copper with a thick film of a glass type dielectric material and curing the dielectric material in nitrogen atmosphere thereby bonding the glass frit to the glass type dielectric material.