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An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of

An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of a polymer based, thermally conductive dielectric such as the dielectric used in the manufacture of Thermal CladTM. The hot layer of Thermal CladTM(i.e., the layer that receives heat) is laminated directly to a heat sink. The cold layer of Thermal CladTMis laminated directly to a cold plate which is, in turn, coupled to the circuit module.

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An apparatus for cooling a circuit module comprising: a heat sink, a thermo-electric device comprising a series of semiconductor regions sandwiched between first and second electrically conductive layers, a thin polymer-based dielectric layer having a first face bonded to said heat sink, and a secon

An apparatus for cooling a circuit module comprising: a heat sink, a thermo-electric device comprising a series of semiconductor regions sandwiched between first and second electrically conductive layers, a thin polymer-based dielectric layer having a first face bonded to said heat sink, and a second face bonded to said first electrically conductive layer, for conducting heat from said thermo-electric device towards said heat sink, and said second electrically conductive layer coupled to thermally receive heat from said circuit module.