초록 ▼

A semiconductor wafer processing apparatus has a processing housing including a pair of coaxial hollow cylindrical members each defining an inner cylindrical chamber for directing a treatment medium toward a wafer and an annular chamber for withdrawing the treatment medium. A wafer support which can

A semiconductor wafer processing apparatus has a processing housing including a pair of coaxial hollow cylindrical members each defining an inner cylindrical chamber for directing a treatment medium toward a wafer and an annular chamber for withdrawing the treatment medium. A wafer support which can include a heater holds one or two wafers substantially normal to the axis of the processing housing. The treatment medium is introduced in vapor phase at very low to high velocity and at subatmospheric to superatmospheric pressure. Radiation can be introduced into the housing, and wafers can be automatically moved into and out of the housing and from the housing to another treating apparatus.

대표청구항 ▼

Semiconductor wafer processing apparatus comprising, in combination, a processing housing having an axis, means for supporting at least one wafer at a wafer treating position along said housing axis and substantially normal thereto, a first housing member centered on said axis along one side of said

Semiconductor wafer processing apparatus comprising, in combination, a processing housing having an axis, means for supporting at least one wafer at a wafer treating position along said housing axis and substantially normal thereto, a first housing member centered on said axis along one side of said wafer treating position, means for introducing and directing a treatment medium into said first housing member in a direction substantially parallel to said axis and toward said wafer treating position, a second housing member centered on said axis on the other side of said wafer treating position, and means for introducing and directing a treatment medium into said second housing member in a direction substantially parallel to said axis and toward said wafer treating position, each of said first and second housing members comprising a first inner cylindrical wall portion and a second outer cylindrical wall portion, said wall portions being coaxial and defining an inner cylindrical chamber for direction the treatment medium towards said wafer treating position and an outer annular chamber for directing the treatment medium away form said wafer treating position, the opening into said annular chamber being substantially radially outward from said wafer treating position.