|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||361/386 ; 361/388 ; 361/389 ; 361/424|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 88 인용 특허 : 0|
The electronic device housing employs unique temperature management functions. Thermally sensitive electronic components are thermally isolated from the environment and from temperature generating components provided within the housing through the use of an insulative case material. Furthermore, heat generating components are connected to the outside environment with a conductive thermal path which is isolated from the remaining components provided within the case, thereby efficiently transferring undesired heat to the environment without allowing the he...
A housing for an electronic device having a first circuit with an operating parameter affected by variations in temperature and a second circuit developing undesired heat to be removed therefrom, said housing comprising: a case having a bottom and sides formed of a relatively thermally non-conductive material having at least first and second thermally separated cavities for receiving said first and second circuits respectively, said case having an opening between said second cavity and the exterior of said case; a cover for said case; a heat transfer pla...