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Flip chip type semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/66
  • H01L-029/34
출원번호 US-0314166 (1989-02-22)
우선권정보 JP-0041180 (1988-02-23)
발명자 / 주소
  • Takada Norimasa (Tokyo JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 115  인용 특허 : 0

초록 ▼

A flip chip type semiconductor device includes a substrate, a polyimide film and an inorganic passivation film. An opening having a rectangular configuration is formed in the inorganic passivation layer provided on an electrode pad. The polyimide film is formed within the opening and on the inorgani

대표청구항 ▼

A flip chip type semiconductor device comprising a semiconductor substrate including a central portion and a peripheral portion and having a major surface on said central portion and said peripheral portion; an insulating layer selectively formed on said major surface of said central portion and ent

이 특허를 인용한 특허 (115)

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