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Molded integrated circuit package incorporating heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0479073 (1990-02-12)
발명자 / 주소
  • Hernandez Jorge M. (Mesa AZ) Simpson Scott (Woodstock CT)
출원인 / 주소
  • Rogers Corporation (Rogers CT 02)
인용정보 피인용 횟수 : 63  인용 특허 : 0

초록 ▼

A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip

대표청구항 ▼

A molded integrated circuit (IC) package comprising: lead frame means, said lead frame means including a plurality of conductive fingers arranged in a pre-selected pattern, said fingers each having a first end and a second end, said first ends of said fingers terminating at an inner space; an integr

이 특허를 인용한 특허 (63)

  1. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages.
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  2. Mahulikar Deepak ; Hoffman Paul R. ; Braden Jeffrey S., Ball grid array electronic package.
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  3. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  4. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  5. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  6. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  7. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Ball grid array package fabrication with IC die support structures.
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  8. Zhao, Sam Ziqun; Khan, Rezaur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package having one or more stiffeners.
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  9. Khan, Reza-ur Rahman; Zhong, Chong Hua, Ball grid array package substrates and method of making the same.
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  10. Khan,Reza ur Rahman; Zhong,Chong Hua, Ball grid array package substrates with a modified central opening and method for making the same.
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  11. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package with multiple interposers.
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  12. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package with patterned stiffener layer.
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  13. Zhao, Sam Ziqun; Khan, Reza ur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package with patterned stiffener surface and method of assembling the same.
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  14. Zhao, Sam Ziqun; Rahman Khan, Reza ur, Ball grid array package with separated stiffener layer.
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  15. Khan,Reza ur Rahman; Zhao,Sam Ziqun, Ball grid array package with stepped stiffener layer.
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  16. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Die down ball grid array package.
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  17. Khan, Reza-Ur Rahman; Zhao, Sam Ziqun, Die down ball grid array packages and method for making same.
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  18. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Die-down ball grid array package with die-attached heat spreader and method for making the same.
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  19. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same.
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  20. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package with a heat spreader and method for making the same.
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  21. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with attached stiffener ring.
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  22. Zhao, Sam Z; Khan, Reza-ur R, Die-up ball grid array package with die-attached heat spreader.
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  23. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Die-up ball grid array package with enhanced stiffener.
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  24. Khan,Reza ur Rahman; Zhao,Sam Ziqun; Bacher,Brent, Die-up ball grid array package with patterned stiffener opening.
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  25. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with printed circuit board attachable heat spreader.
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  26. Zhao,Sam Z; Khan,Reza ur R, Die-up ball grid array package with printed circuit board attachable heat spreader.
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  27. Ference Thomas G. ; Howell Wayne J. ; Sprogis Edmund J., Dual chip with heat sink.
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  28. Rahman Khan,Reza ur; Zhao,Sam Ziqun, Enhanced die-down ball grid array and method for making the same.
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  29. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Enhanced die-up ball grid array packages and method for making the same.
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  30. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
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  31. Lemke, Timothy A.; Houtz, Timothy W., High density connector and method of manufacture.
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  32. Lemke,Timothy A.; Houtz,Timothy W., High density connector and method of manufacture.
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  33. Khan,Reza ur Rahman; Zhao,Sam Ziqun, IC die support structures for ball grid array package fabrication.
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  34. Zhang, Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
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  35. Zhang,Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
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  36. Murphy James V., Integrated circuit intercoupling component with heat sink.
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  37. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.
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  38. Zhong, Chong Hua; Khan, Rezaur Rahman, Low voltage drop and high thermal performance ball grid array package.
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  39. Zhong, Chonghua; Khan, Reza-ur Rahman, Low voltage drop and high thermal performance ball grid array package.
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  40. Zhong,Chong Hua; Rahman Khan,Reza ur, Low voltage drop and high thermal performance ball grid array package.
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  41. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Method for assembling a ball grid array package with multiple interposers.
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  42. Zhao,Sam Zinqun; Khan,Reza ur Rahman; Chaudhry,Imtiaz, Method for assembling a ball grid array package with two substrates.
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  43. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Chaudhry, Imtiaz, Method for making an enhanced die-up ball grid array package with two substrates.
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  44. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Method of assembling a ball grid array package with patterned stiffener layer.
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  45. Brand Joseph M., Method of forming heat sink and semiconductor chip assemblies.
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  46. Brand, Joseph M., Method of forming heat sink and semiconductor chip assemblies.
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  47. Joseph M. Brand, Method of forming heat sink and semiconductor chip assemblies.
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  48. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader.
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  49. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.
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  50. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.
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  52. Kornblum Matthew Alan (Charlotte NC) Finocchi Lawrence Dominic (Charlotte NC) Hilliard Mark Andrew (Gastonia NC), Motor control housing.
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  53. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
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  54. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
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  55. Zhao, Sam Ziqun; Khan, Rezaur Rahman, No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement.
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  56. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
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  57. Yasunaga, Shoji, Resin-sealed semiconductor device.
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  58. Sano, Hikari; Tomita, Yoshihiro; Nakano, Takahiro, Semiconductor chip and semiconductor device.
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  59. Sakamoto, Noriaki; Kobayashi, Yoshiyuki; Sakamoto, Junji; Okada, Yukio; Igarashi, Yusuke; Maehara, Eiju; Takahashi, Kouji, Semiconductor device, semiconductor module and hard disk.
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  60. Huang Chien-Ping,TWX ; Tseng Wei-Chen,TWX, Semiconductor package structure having universal lead frame and heat sink.
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  61. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
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  62. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array package.
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  63. Zhao, Sam Ziqun; Khan, Reaz-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array packaging.
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