이 특허를 인용한 특허 (18)

1. Reed, Paul, Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards.

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2. Prancz Markus,ATX, Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module ther.

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3. Sasov Yuriy Dmitrievich,RUX, Double-sided electronic device.

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4. Prince David G. ; Principe Daniel D., Encapsulated printed circuit assembly and method and manufacturing the same.

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5. Leighton, Keith R., Hot lamination process for the manufacture of a combination contact/contactless smart card.

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6. Leighton Keith, Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom.

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7. Fidalgo Jean-Christophe (Gemenos FRX), Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for.

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8. Ohbuchi Jun,JPX ; Miura Hiroshi,JPX ; Nishino Kiyotaka,JPX ; Onoda Shigeo,JPX ; Washida Tetsuro,JPX ; Omori Makoto,JPX, IC card and method of making the same.

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9. Radenne,Jean Pierre; De Maquille,Yannick; Mischler,Jean Jacques; Mathieu,Christophe, Method for encapsulation of a chip card and module obtained thus.

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10. Reed, Paul, Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces.

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11. Tiffany ; III Harry J., Method for making tamper-preventing, contact-type, smart cards.

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12. Corniglion Isabelle,FRX ; Fidalgo Jean-Christophe,FRX ; Leriche Christian,FRX, Method for the manufacture of electronic cards and cards obtained thereby.

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13. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification ca.

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14. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards.

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15. Tamaki, Kazuo, Semiconductor apparatus and method of producing the same.

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16. Tane Yasuo,JPX ; Tanaka Kazuyasu,JPX, Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein.

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17. Keith R. Leighton, Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.

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18. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.

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