이 특허를 인용한 특허 (56)

1. Kim, Jaeyeon, Aluminum-comprising target/backing plate structures.

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2. Snow, David; Chase, Michael; Woidtke, Alex; Mauritsen, Luke; Henslee, Isaac; Sellin, Peter B.; Merkel, Kris, Apparatus and methods for improving vibration isolation, thermal dampening, and optical access in cryogenic refrigerators.

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3. Snow, David; Chase, Michael; Woidtke, Alex; Mauritsen, Luke; Sellin, Peter B.; Merkel, Kris, Apparatus and methods for improving vibration isolation, thermal dampening, and optical access in cryogenic refrigerators.

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4. Browne James M., Apparatus for making thermally conductive film.

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5. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.

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6. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.

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7. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.

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8. Shigeru Ishii JP; Shigeki Mori JP; Hirokazu Nishimura JP; Shinji Nakai JP, Cable and heat sink.

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9. Dilley Roland L. ; Kiser Carl E., Carbon/carbon heat spreader.

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10. Dean, Nancy F.; Emigh, Roger A.; Pinter, Michael R.; Smith, Charles; Knowles, Timothy R.; Ahmadi, Mani; Ellman, Brett M.; Seaman, Christopher L., Compliant fibrous thermal interface.

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11. Getz, Jr., George; Frastaci, Michael, Composite heat sink with metal base and graphite fins.

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12. Ingram,Jason W., Conductive heat transfer system and method for integrated circuits.

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13. Zamel,James M.; Wickham,Michael G.; Brosnan,Stephen J., Cooled high power laser lens array.

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14. Knowles, Timothy R.; Seaman, Christopher L., Dendritic fiber material.

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15. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.

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16. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.

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17. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.

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18. Sarno, Claude; Moulin, Georges, Electronic module with high cooling power.

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19. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards and electronic components thereof.

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20. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.

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21. Guy James K., Fiber optic bundle interstitial cooling using heat pipe technology.

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22. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Taylor, Joseph Daniel, Flexible thermal conduit for an electronic device.

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23. Garner Scott D. ; Toth Jerome E., Heat dissipating computer case having oriented fibers and heat pipe.

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24. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Heat dissipating device for a CPU.

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25. Arnold Judson V. (Bedford TX) Peoples James R. (Burleson TX) McKague Elbert L. (Fort Worth TX), High heat density transfer device.

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26. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., High heat density transfer device.

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27. Yao Akira,JPX, Interface portion structure and reinforcing structure of flexible thermal joint.

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28. M?ller, Helmut; Tobias, Daniel, Manipulator for an optical or particle-optical apparatus.

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29. Beane Alan F. (Gilford NH) Beane Glenn L. (Plymouth NH), Manufacturing particles and articles having engineered properties.

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30. Beane Alan F. ; Beane Glenn L., Manufacturing particles and articles having engineered properties.

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31. Beane Alan F. ; Beane Glenn L., Manufacturing particles and articles having engineered properties.

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32. Browne James M., Method of making and using thermally conductive joining film.

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33. Woidtke, Alex; Sellin, Peter B.; Thiel, Charles; Harrington, Calvin C., Methods and apparatus for providing rotational movement and thermal stability to a cooled sample.

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34. Kim, Jaeyeon, Methods of bonding two aluminum-comprising masses to one another.

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35. Kawabe Shin,JPX, Mobile information processing apparatus and covers for the mobile information processing apparatus and the desktop information processing apparatus.

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36. M？ller,Helmut, Particle beam apparatus.

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37. Bhatia Rakesh, Power cable heat exchanger for a computing device.

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38. Natishan Paul M. ; Morrish Arthur M. ; Edelstein Alan S. ; Everett Richard K. ; Pehrsson Pehr E., Process for making diamond and diamond-coated filaments.

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39. Obermeyer, Henry K.; Gilbert, Eric N.; Baker, Grant Quinn, Process of manufacturing fiber reinforced composite via selective infusion of resin and resin blocking substance.

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40. Reyes, Jaime M.; Britton, Meghan, Stirling radioisotope generator and thermal management system.

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41. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.

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42. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using microchannels.

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43. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System and method of operating an electrical energy storage device or an electrochemical energy generation device using thermal conductivity materials based on mobile device states and vehicle states.

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44. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System and method of operating an electrical energy storage device or an electrochemical energy generation device, during charge or discharge using microchannels and high thermal conductivity materials.

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45. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System for altering temperature of an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials based on states of the device.

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46. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System for altering temperature of an electrical energy storage device or an electrochemical energy generation device using microchannels based on states of the device.

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47. Chan, Alistair K.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., System for operating an electrical energy storage device or an electrochemical energy generation device using microchannels based on mobile device states and vehicle states.

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48. W. Scott Bonneville ; Roger A. Stonier, Thermal harness using encased carbon-based fiber and end attachment brackets.

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49. Bonneville W. Scott, Thermal harness using thermal conductive fiber and polymer matrix material.

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50. Chen, Ga-Lane; Leu, Charles, Thermal interface material.

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51. Balzano Alfiero, Thermal management system.

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52. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.

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53. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.

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54. Michael R. Pinter ; Nancy F. Dean ; William B. Willett ; Amy Gettings ; Charles Smith, Transferrable compliant fibrous thermal interface.

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55. Pinter, Michael R.; Dean, Nancy F.; Willett, William B.; Gettings, Amy; Smith, Charles, Transferrable compliant fibrous thermal interface.

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56. Woidtke, Alex; Sellin, Peter B.; Mauritsen, Luke; Snow, David, Vibration reducing sample mount with thermal coupling.

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