이 특허를 인용한 특허 (182)

1. Swindlehurst,Susan; Hadley,Mark A.; Drzaic,Paul S.; Craig,Gordon S. W.; Gengel,Glenn; Hermann,Scott; Tootoochi,Aly; Eisenhardt,Randolph W., Apparatus incorporating small-feature-size and large-feature-size components and method for making same.

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2. Hadley, Mark A.; Carrender, Curt L.; Smith, John Stephen; Craig, Gordon S. W., Assembly comprising a functional device and a resonator and method of making same.

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3. Hadley,Mark A.; Carrender,Curt L.; Smith,John Stephen; Craig,Gordon S. W., Assembly comprising a functional device and a resonator and method of making same.

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4. Craig, Gordon S. W.; Hadley, Mark A.; Swindlehurst, Susan; Tootoonchi, Ali A.; Kanemoto, Eric; Snyder, Eric Jonathan; Herrmann, Scott; Gengel, Glenn; Liong, Lily, Assembly comprising functional block deposited therein.

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5. Craig,Gordon S. W.; Tootoonchi,Ali A.; Eisenhardt,Randolph W.; Herrmann,Scott; Hadley,Mark A.; Drzaic,Paul S., Assembly comprising functional devices and method of making same.

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6. Breed, David S.; Du Vall, Wilbur E.; Johnson, Wendell C., Automotive electronic safety network.

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7. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Automotive electronic safety network.

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8. Caskey, Terrence; Mohammed, Ilyas; Uzoh, Cyprian Emeka; Woychik, Charles G.; Newman, Michael; Monadgemi, Pezhman; Co, Reynaldo; Chau, Ellis; Haba, Belgacem, BVA interposer.

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9. Subido, Willmar; Co, Reynaldo; Zohni, Wael; Prabhu, Ashok S., Ball bonding metal wire bond wires to metal pads.

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10. Agahdel, Fariborz; Griswold, Brad; Husain, Syed; Moti, Robert; Robinette, Jr., William C.; Ho, Chung W., Bare die carrier.

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11. Haba, Belgacem; Mohammed, Ilyas; Wang, Liang, Batch process fabrication of package-on-package microelectronic assemblies.

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12. Haba, Belgacem; Mohammed, Ilyas; Wang, Liang, Batch process fabrication of package-on-package microelectronic assemblies.

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13. Haba, Belgacem; Mohammed, Ilyas; Wang, Liang, Batch process fabrication of package-on-package microelectronic assemblies.

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14. Saxton, David Michael, Bi-material strip and a method of bonding strips of different materials together.

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15. Katkar, Rajesh; Gao, Guilian; Woychik, Charles G.; Zohni, Wael, Bond via array for thermal conductivity.

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16. Jacksen,Niels F.; Iosue,Michael J.; Saldana,Miguel M.; Tucker,Jay Scott, Bonding methods for microchannel plates.

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17. William A. Groll, Bonding of dissimilar metals.

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18. Crotzer David R. (Windham NH) Hanrahan Mark G. (N. Attleboro MA) Pickles Charles S. (N. Attleboro MA), Chemically grafted electrical devices.

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19. Gates, Geoffrey William; Bumb, Jr., Frank E., Compliant interconnect assembly.

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20. Lin, Charles W. C.; Chiang, Cheng-Lien, Compliant test probe with jagged contact surface.

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21. Kubota,Yoichi; Kang,Teck Gyu; Park,Jae M.; Haba,Belgacem, Components with posts and pads.

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22. Crotzer David R. ; Goodwin Jonathan W. ; Michaud Arthur G. ; DeDonato David A., Conductive elastomers and methods for fabricating the same.

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23. Liong, Lily; Schatz, Kenneth D.; Craig, Gordon; Hadley, Mark A.; Kanemoto, Eric, Creating recessed regions in a substrate and assemblies having such recessed regions.

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24. Uzoh, Cyprian Emeka; Katkar, Rajesh, Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects.

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25. Hiwada Kiyoyasu (Yamato JPX), Electrical connection structure.

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26. Srbinovski, Igorce, Electrical switch.

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27. Bahn, Robert J.; Blum, Fred A.; Neuhaus, Herbert J.; Zou, Bin, Electroless process for the preparation of particle enhanced electric contact surfaces.

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28. Jacobsen,Jeffrey Jay; Gengel,Glenn Wilhelm; Hadley,Mark A.; Craig,Gordon S. W.; Smith,John Stephen, Electronic devices with small functional elements supported on a carrier.

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29. DeLaCruz, Javier A.; Awujoola, Abiola; Prabhu, Ashok S.; Lattin, Christopher W.; Sun, Zhuowen, Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces.

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30. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.

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31. Haba, Belgacem; Mohammed, Ilyas, Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation.

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32. Katkar, Rajesh, Fine pitch BVA using reconstituted wafer with area array accessible for testing.

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33. Katkar, Rajesh, Fine pitch BVA using reconstituted wafer with area array accessible for testing.

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34. Haba, Belgacem; Kubota, Yoichi; Kang, Teck-Gyu; Park, Jae M., Fine pitch microcontacts and method for forming thereof.

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35. Kwon, Jinsu, Flip chip interconnection with double post.

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36. Haba, Belgacem; Beroz, Masud; Kim, Young-Gon; Tuckerman, David B., Formation of circuitry with modification of feature height.

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37. Haba,Belgacem; Beroz,Masud; Kim,Young Gon; Tuckerman,David B., Formation of circuitry with modification of feature height.

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38. Jerry W. Zimmer ; Daniel A. Worsham, Formation of diamond particle interconnects.

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39. Clayton, Gary A., Grid interposer.

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40. Mohammed, Ilyas; Beroz, Masud, Heat spreading substrate with embedded interconnects.

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41. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Integrated occupant protection system.

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42. Lewinnek, David Walter; Sinsheimer, Roger Allen; Valiente, Luis Antonio; DiPalo, Craig Anthony, Interconnect for transmitting signals between a device and a tester.

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43. Gupta, Debabrata; Hashimoto, Yukio; Mohammed, Ilyas; Mirkarimi, Laura Wills; Katkar, Rajesh, Interconnect structure.

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44. Gupta, Debabrata; Hashimoto, Yukio; Mohammed, Ilyas; Mirkarimi, Laura; Katkar, Rajesh, Interconnect structure.

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45. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.

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46. Fisher,Rayette Ann; Burdick, Jr.,William Edward; Rose,James Wilson, Large area transducer array.

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47. Katkar, Rajesh; Uzoh, Cyprian Emeka, Low CTE component with wire bond interconnects.

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48. Katkar, Rajesh; Uzoh, Cyprian Emeka, Low CTE component with wire bond interconnects.

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49. Brindle, Steven R.; Bumb, Jr., Frank E.; Burg, John S.; Chu, Kwang-Ho; Mathews, Alexander R.; Revell, Ronald K., Low contact force, dual fraction particulate interconnect.

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50. Ecer Gunes M., Low temperature bonding of materials.

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51. Berge, Layne A.; Dangler, John R.; Doyle, Matthew S.; Hefner, Jesse, Metallized particle interconnect with solder components.

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52. DiFrancesco Louis, Method and apparatus for momentum plating.

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53. Berger, Franz; Burtsche, Daniel; Meyer, Jürgen; Schreiner, Sven, Method for fixing a connecting element on a workpiece and component comprising a workpiece with a connecting element fixed on it.

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54. Haba, Belgacem; Kang, Teck-Gyu; Mohammed, Ilyas; Chau, Ellis, Method for making a microelectronic assembly having conductive elements.

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55. Co, Reynaldo; Mirkarimi, Laura, Method for package-on-package assembly with wire bonds to encapsulation surface.

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56. Co, Reynaldo; Mirkarimi, Laura, Method for package-on-package assembly with wire bonds to encapsulation surface.

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57. Rates James T. (Longwood FL), Method for providing known good bare semiconductor die.

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58. Farnworth Warren M., Method for testing semiconductor packages using oxide penetrating test contacts.

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59. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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60. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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61. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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62. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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63. Zhao, Zhijun; Alatorre, Roseann, Method of forming a component having wire bonds and a stiffening layer.

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64. Mohammed, Ilyas, Method of forming a wire bond having a free end.

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65. Kubota, Yoichi; Kang, Teck-Gyu; Park, Jae M.; Haba, Belgacem, Method of making a connection component with posts and pads.

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66. Kubota, Yoichi; Kang, Teck-Gyu; Park, Jae M.; Haba, Belgacem, Method of making a connection component with posts and pads.

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67. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Method of making a radio frequency identification (RFID) tag.

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68. Credelle,Thomas Lloyd; Gengel,Glenn; Stewart,Roger Green; Joseph,William Hill, Methods for making electronic devices with small functional elements supported on a carriers.

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69. Fisher, Rayette Ann; Burdick, Jr., William Edward; Rose, James Wilson, Methods of fabricating a large area transducer array.

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70. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Methods of making a radio frequency identification (RFID) tags.

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71. Damberg, Philip; Haba, Belgacem; Tuckerman, David B.; Kang, Teck-Gyu, Micro pin grid array with pin motion isolation.

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72. Damberg, Philip; Haba, Belgacem; Tuckerman, David B.; Kang, Teck-Gyu, Micro pin grid array with pin motion isolation.

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73. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectonic packages and methods therefor.

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74. Mohammed, Ilyas; Haba, Belgacem, Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation.

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75. Mohammed, Ilyas; Haba, Belgacem, Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation.

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76. Haba, Belgacem; Mitchell, Craig S., Microelectronic assemblies having very fine pitch stacking.

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77. Mohammed, Ilyas; Haba, Belgacem, Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation.

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78. Haba, Belgacem; Mohammed, Ilyas; Caskey, Terrence; Co, Reynaldo; Chau, Ellis, Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface.

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79. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.

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80. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.

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81. Haba, Belgacem; Crisp, Richard Dewitt; Zohni, Wael, Microelectronic element with bond elements to encapsulation surface.

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82. Haba, Belgacem; Beroz, Masud; Humpston, Giles; Park, Jae M., Microelectronic package comprising offset conductive posts on compliant layer.

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83. Prabhu, Ashok S.; Katkar, Rajesh, Microelectronic package for wafer-level chip scale packaging with fan-out.

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84. Haba, Belgacem, Microelectronic package with terminals on dielectric mass.

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85. Haba, Belgacem, Microelectronic package with terminals on dielectric mass.

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86. Haba, Belgacem, Microelectronic package with terminals on dielectric mass.

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87. Haba, Belgacem, Microelectronic package with terminals on dielectric mass.

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88. Haba, Belgacem; Beroz, Masud; Green, Ronald; Mohammed, Ilyas; Wilson, Stuart E.; Zohni, Wael; Kubota, Yoichi; Thompson, Jesse Burl, Microelectronic packages and methods therefor.

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89. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.

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90. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.

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91. Haba, Belgacem; Kang, Teck-Gyu; Mohammed, Ilyas; Chau, Ellis, Microelectronic packages and methods therefor.

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92. Haba, Belgacem; Kang, Teck-Gyu; Mohammed, Ilyas; Chau, Ellis, Microelectronic packages and methods therefor.

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93. Haba, Belgacem; Kang, Teck-Gyu; Mohammed, Ilyas; Chau, Ellis, Microelectronic packages and methods therefor.

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94. Haba, Belgacem; Kang, Teck-Gyu; Mohammed, Ilyas; Chau, Ellis, Microelectronic packages and methods therefor.

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95. Haba,Belgacem; Beroz,Masud; Green,Ronald; Mohammed,Ilyas; Wilson,Stuart E.; Zohni,Wael; Kubota,Yoichi; Thompson,Jesse Burl, Microelectronic packages and methods therefor.

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96. Haba,Belgacem; Beroz,Masud; Kang,Teck Gyu; Kubota,Yoichi; Krishnan,Sridhar; Riley, III,John B.; Mohammed,Ilyas, Microelectronic packages and methods therefor.

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97. Haba, Belgacem, Microelectronic packages with dual or multiple-etched flip-chip connectors.

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98. Haba, Belgacem, Microelectronic packages with dual or multiple-etched flip-chip connectors.

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99. Haba, Belgacem, Microelectronic packages with nanoparticle joining.

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100. Haba, Belgacem, Microelectronic packages with nanoparticle joining.

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101. Haba, Belgacem, Microelectronic packages with nanoparticle joining.

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102. Uzoh, Cyprian Emeka; Katkar, Rajesh, Multiple bond via arrays of different wire heights on a same substrate.

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103. Uzoh, Cyprian Emeka; Katkar, Rajesh, Multiple bond via arrays of different wire heights on a same substrate.

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104. Haba, Belgacem; Co, Reynaldo; Cizek, Rizza Lee Saga; Zohni, Wael, Off substrate kinking of bond wire.

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105. Haba, Belgacem; Co, Reynaldo; Saga Cizek, Rizza Lee; Zohni, Wael, Off substrate kinking of bond wire.

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106. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young, Package-on-package assembly with wire bond vias.

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107. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young, Package-on-package assembly with wire bond vias.

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108. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young, Package-on-package assembly with wire bond vias.

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109. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young, Package-on-package assembly with wire bond vias.

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110. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young, Package-on-package assembly with wire bond vias.

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111. Chau, Ellis; Co, Reynaldo; Alatorre, Roseann; Damberg, Philip; Wang, Wei-Shun; Yang, Se Young; Zhao, Zhijun, Package-on-package assembly with wire bond vias.

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112. Sato, Hiroaki; Kang, Teck-Gyu; Haba, Belgacem; Osborn, Philip R.; Wang, Wei-Shun; Chau, Ellis; Mohammed, Ilyas; Masuda, Norihito; Sakuma, Kazuo; Hashimoto, Kiyoaki; Inetaro, Kurosawa; Kikuchi, Tomoyuki, Package-on-package assembly with wire bonds to encapsulation surface.

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113. Sato, Hiroaki; Kang, Teck-Gyu; Haba, Belgacem; Osborn, Philip R.; Wang, Wei-Shun; Chau, Ellis; Mohammed, Ilyas; Masuda, Norihito; Sakuma, Kazuo; Hashimoto, Kiyoaki; Inetaro, Kurosawa; Kikuchi, Tomoyuki, Package-on-package assembly with wire bonds to encapsulation surface.

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114. Sato, Hiroaki; Kang, Teck-Gyu; Haba, Belgacem; Osborn, Philip R.; Wang, Wei-Shun; Chau, Ellis; Mohammed, Ilyas; Masuda, Norihito; Sakuma, Kazuo; Hashimoto, Kiyoaki; Inetaro, Kurosawa; Kikuchi, Tomoyuki, Package-on-package assembly with wire bonds to encapsulation surface.

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115. Sato, Hiroaki; Kang, Teck-Gyu; Haba, Belgacem; Osborn, Philip R.; Wang, Wei-Shun; Chau, Ellis; Mohammed, Ilyas; Masuda, Norihito; Sakuma, Kazuo; Hashimoto, Kiyoaki; Inetaro, Kurosawa; Kikuchi, Tomoyuki, Package-on-package assembly with wire bonds to encapsulation surface.

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116. Sato, Hiroaki; Kang, Teck-Gyu; Haba, Belgacem; Osborn, Philip R.; Wang, Wei-Shun; Chau, Ellis; Mohammed, Ilyas; Masuda, Norihito; Sakuma, Kazuo; Hashimoto, Kiyoaki; Inetaro, Kurosawa; Kikuchi, Tomoyuki, Package-on-package assembly with wire bonds to encapsulation surface.

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117. Prabhu, Ashok S.; Katkar, Rajesh, Packaged microelectronic device for a package-on-package device.

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118. Haba, Belgacem; Mohammed, Ilyas, Pin attachment.

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119. Co, Reynaldo; Villavicencio, Grant; Zohni, Wael, Pressing of wire bond wire tips to provide bent-over tips.

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120. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.

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121. Masuda, Kenichi, Probe structure and manufacturing method thereof.

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122. Chong Fu Chiung, Programmable high-density electronic device testing.

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123. Hadley, Mark A.; Carrender, Curt L.; Smith, John Stephen, RFID strap capacitively coupled and method of making same.

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124. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.

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125. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.

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126. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.

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127. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Torn; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.

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128. Gengel,Glenn W.; Hadley,Mark A.; Pounds,Tom; Schatz,Kenneth D.; Drzaic,Paul S., RFID tags and processes for producing RFID tags.

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129. Gengel,Glenn W.; Hadley,Mark A.; Pounds,Tom; Schatz,Kenneth D.; Drzaic,Paul S., RFID tags and processes for producing RFID tags.

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130. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.

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131. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.

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132. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.

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133. Mohammed, Ilyas, Reconstituted wafer-level package DRAM.

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134. Mohammed, Ilyas, Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package.

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135. Lykins ; II James L., Rough electrical contact surface.

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136. Lykins ; II James L., Rough electrical contact surface.

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137. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.

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138. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.

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139. Haba, Belgacem; Co, Reynaldo; Saga Cizek, Rizza Lee; Zohni, Wael, Severing bond wire by kinking and twisting.

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140. Breed, David S., Single side curtain airbag for vehicles.

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141. McMillan John R. ; Maslakow William H. ; Abelanet Marc A., Socket assembly for integrated circuit chip carrier package.

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142. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.

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143. Wilson, Stuart E.; Green, Ronald; Crisp, Richard Dewitt; Humpston, Giles, Stack microelectronic assemblies.

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144. Haba, Belgacem, Stackable molded microelectronic packages.

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145. Haba, Belgacem, Stackable molded microelectronic packages.

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146. Haba, Belgacem, Stackable molded microelectronic packages.

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147. Haba, Belgacem, Stackable molded microelectronic packages.

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148. Haba, Belgacem, Stackable molded microelectronic packages.

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149. Haba, Belgacem, Stackable molded microelectronic packages with area array unit connectors.

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150. Haba, Belgacem, Stackable molded microelectronic packages with area array unit connectors.

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151. Haba, Belgacem; Mitchell, Craig S.; Beroz, Masud, Stacked packaging improvements.

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152. Haba, Belgacem; Mitchell, Craig S.; Beroz, Masud, Stacked packaging improvements.

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153. Haba, Belgacem; Mitchell, Craig S.; Beroz, Masud, Stacked packaging improvements.

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154. Haba, Belgacem; Mitchell, Craig S.; Beroz, Masud, Stacked packaging improvements.

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155. Haba, Belgacem; Mitchell, Craig S.; Beroz, Masud, Stacked packaging improvements.

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156. Villavicencio, Grant; Lee, Sangil; Alatorre, Roseann; Delacruz, Javier A.; McGrath, Scott, Stiffened wires for offset BVA.

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157. Craig,Gordon S. W.; Tootoonchi,Ali A.; Herrmann,Scott; Gengel,Glenn; Eisenhardt,Randy, Strap assembly comprising functional block deposited therein and method of making same.

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158. Haba, Belgacem; Mohammed, Ilyas; Caskey, Terrence; Co, Reynaldo; Chau, Ellis, Structure for microelectronic packaging with bond elements to encapsulation surface.

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159. Haba, Belgacem; Mohammed, Ilyas; Caskey, Terrence; Co, Reynaldo; Chau, Ellis, Structure for microelectronic packaging with bond elements to encapsulation surface.

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160. Haba, Belgacem; Mohammed, Ilyas, Structure for microelectronic packaging with terminals on dielectric mass.

     상세보기
161. Sinsheimer, Roger Allen, Structure for transmitting signals in an application space between a device under test and test electronics.

     상세보기
162. Uzoh, Cyprian Emeka, Structures and methods for low temperature bonding using nanoparticles.

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163. Uzoh, Cyprian Emeka, Structures and methods for low temperature bonding using nanoparticles.

     상세보기
164. Mohammed, Ilyas, Substrate-less stackable package with wire-bond interconnect.

     상세보기
165. Mohammed, Ilyas, Substrate-less stackable package with wire-bond interconnect.

     상세보기
166. Mohammed, Ilyas, Substrate-less stackable package with wire-bond interconnect.

     상세보기
167. Raymond Douglas W., System for circuit modules having a plurality of independently positionable probes.

     상세보기
168. Suto, Anthony J.; Wrinn, Joseph Francis; Toscano, John P.; Arena, John Joseph, Test fixture.

     상세보기
169. McElrea, Simon; Zohni, Wael; Haba, Belgacem, Through interposer wire bond using low CTE interposer with coarse slot apertures.

     상세보기
170. Carrender,Curt, Transponder incorporated into an electronic device.

     상세보기
171. Breed David S. ; Duvall Wilbur E. ; Johnson Wendell C., Vehicle electrical system.

     상세보기
172. Breed, David S., Vehicle software upgrade techniques.

     상세보기
173. Breed, David S., Vehicle software upgrade techniques.

     상세보기
174. Breed, David S., Vehicle software upgrade techniques.

     상세보기
175. Katkar, Rajesh; Vu, Tu Tam; Lee, Bongsub; Bang, Kyong-Mo; Li, Xuan; Huynh, Long; Guevara, Gabriel Z.; Agrawal, Akash; Subido, Willmar; Mirkarimi, Laura Wills, Wafer-level packaging using wire bond wires in place of a redistribution layer.

     상세보기
176. Jacobsen,Jeffrey Jay; Gengel,Glenn Wilhelm; Hadley,Mark A.; Craig,Gordon S. W.; Smith,John Stephen, Web process interconnect in electronic assemblies.

     상세보기
177. Co, Reynaldo; Zohni, Wael; Cizek, Rizza Lee Saga; Katkar, Rajesh, Wire bond support structure and microelectronic package including wire bonds therefrom.

     상세보기
178. Co, Reynaldo; Zohni, Wael; Saga Cizek, Rizza Lee; Katkar, Rajesh, Wire bond support structure and microelectronic package including wire bonds therefrom.

     상세보기
179. Awujoola, Abiola; Sun, Zhuowen; Zohni, Wael; Prabhu, Ashok S.; Subido, Willmar, Wire bond wires for interference shielding.

     상세보기
180. Awujoola, Abiola; Sun, Zhuowen; Zohni, Wael; Prabhu, Ashok S.; Subido, Willmar, Wire bond wires for interference shielding.

     상세보기
181. Huang, Shaowu; Delacruz, Javier A., Wire bonding method and apparatus for electromagnetic interference shielding.

     상세보기
182. Prabhu, Ashok S.; Katkar, Rajesh, ‘RDL-First’ packaged microelectronic device for a package-on-package device.

     상세보기
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