$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cold plate for cooling electronics

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0520801 (1990-05-08)
발명자 / 주소
  • Ciaccio Michael P. (Rockford IL)
출원인 / 주소
  • Sundstrand Corporation (Rockford IL 02)
인용정보 피인용 횟수 : 88  인용 특허 : 0

초록

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling

대표청구항

A cold plate for cooling electronic components comprising a plurality of layers which are assembled in stacked relation, said plurality of layers including a heat exchanger layer, means defining a flow path for circulating a cooling liquid through said cold plate for cooling electronic components lo

이 특허를 인용한 특허 (88)

  1. Hurlbert, Kathryn M.; Ruemmele, Warren; Nguyen, Hai D.; Andish, Kambiz K.; McCalley, Sean M., Apparatus and method for extracting heat from a device.
  2. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  3. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  4. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  5. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  6. Azar, Kaveh, Circuit board cooling system.
  7. Belady Christian L. ; Cromwell S. Daniel, Cold plate arrangement for cooling processor and companion voltage regulator.
  8. Dede, Ercan Mehmet; Liu, Yan, Cold plate assemblies and power electronics modules.
  9. Zaffetti, Mark A., Compact two sided cold plate with threaded inserts.
  10. Zaffetti, Mark A.; Laurin, Michael B., Compact two sided cold plate with transfer tubes.
  11. Pal, Debabrata, Controller cooling arrangement.
  12. Said, Waleed M., Cooling and controlling electronics.
  13. Downing Robert Scott, Cooling apparatus and method of assembling same.
  14. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.
  15. Downing,Robert Scott; Lindsay Jones,Eric Michael, Cooling device for diode pumped laser.
  16. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  17. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  18. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
  19. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  20. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  21. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
  22. Schmidt Roger R. ; Maclachlan William P. ; Horvath Drew R. ; Barringer Dennis R., Enhanced test head liquid cooled cold plate.
  23. Downing, Robert Scott, Evaporative compact high intensity cooler.
  24. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  25. Valenzuela,Javier A.; Jasinski,Thomas J., Heat exchanger.
  26. Dede, Ercan Mehmet; Liu, Yan, Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same.
  27. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  28. Yanase,Atsushi; Takahashi,Masato; Kaneda,Yukihiro, Heat sink and method for its production.
  29. Yanase,Atsushi; Takahashi,Masato; Kaneda,Yukihiro, Heat sink and method for its production.
  30. Kimbara, Masahiko; Toh, Keiji; Kubo, Hidehito; Tanaka, Katsufumi; Otoshi, Kota; Kono, Eiji; Wakabayashi, Nobuhiro; Nakagawa, Shintaro; Furukawa, Yuichi; Yamauchi, Shinobu, Heat sink for power module.
  31. Coleman,Charles, Heatsink for power devices.
  32. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
  33. Zaffetti, Mark A.; Taddey, Edmund P., Integral cold plate and structural member.
  34. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  35. Pal, Debabrata, Integrated thermal packaging of high power motor controller.
  36. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  37. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.
  38. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  39. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.
  40. Dede, Ercan Mehmet, Jet impingement heat exchanger apparatuses and power electronics modules.
  41. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  42. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  43. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  44. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  45. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  46. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  47. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Method of cooling electronic devices using a tube in plate heat sink.
  48. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  49. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  50. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.
  51. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
  52. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  53. Downing Robert Scott ; Wilkinson Scott Palmer ; Sutrina Thomas Albert, Modular coolant manifold for use with power electronics devices having integrated coolers.
  54. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  55. Downing Robert Scott ; Wilkinson Scott Palmer ; Sutrina Thomas Albert, Modular power electronics die having integrated cooling apparatus.
  56. Demmler Holger (Wonfurt DEX) Karl Adolf (Schweinfurt DEX), Motor vehicle with a heat exchanger housing system for cooling automotive accessory components and a heat exchanger hous.
  57. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  58. Olson Robert Leo, Multiple tile scaleable cooling system for semiconductor components.
  59. Pence, Deborah V.; Reyes, Jr., Jose N.; Phillips, Nathan; Wu, Qiao; Groome, John T., Multiscale transport apparatus and methods.
  60. Valenzuela, Javier A., Normal-flow heat exchanger.
  61. Valenzuela, Javier A., Normal-flow heat exchanger.
  62. Valenzuela,Javier A., Normal-flow heat exchanger.
  63. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  64. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
  65. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
  66. Dede, Ercan Mehmet, Power electronics card assemblies, power electronics modules, and power electronics devices.
  67. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  68. Olesen, Klaus Kristen; Eisele, Ronald, Power semiconductor module and method for cooling a power semiconductor module.
  69. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  70. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  71. Coleman,Charles, RF generator with commutation inductor.
  72. Coleman,Charles, RF generator with phase controlled MOSFETs.
  73. Coleman,Charles, RF generator with reduced size and weight.
  74. Coleman,Charles, RF generator with voltage regulator.
  75. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  76. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  77. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  78. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  79. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  80. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  81. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  82. Schuetze,Karl T.; Weaver,Matthew D., Systems and methods for controlling pressure of fluids.
  83. Schuetze, Karl T.; Hudson, Robert S., Systems and methods for controlling temperature and pressure of fluids.
  84. de Bock, Hendrik Pieter Jacobus; Gross, Jr., William Earl; Whalen, Bryan Patrick; Meier, Robert Paul, Systems and methods for dissipating heat in an enclosure.
  85. de Bock, Hendrik Pieter Jacobus; Gross, Jr., William Earl; Whalen, Bryan Patrick; Meier, Robert Paul, Systems and methods for dissipating heat in an enclosure.
  86. Pal, Debabrata, Two-phase electronic component cooling arrangement.
  87. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
  88. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트