초록 ▼

A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under test and the top surface 16. A bottom surfac

A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under test and the top surface 16. A bottom surface 64 of the clamping section has a double spiral cooling circuit machined therein for providing backside cooling. A source vessel 110 maintained at atmospheric pressure provides fluid to the top surface clamping/cooling circuits and a collection vessel 112 maintained at house vacuum pressure collects the fluid. A set of processor controlled valves 114, 118, 128, 130, 132, 141, 142 144, 158 and 164 control the fluid in a preprogrammed sequence. A chiller system 82 and pump 90 provide temperature regulated fluid flow to the clamping section 12 bottom surface 64.

대표청구항 ▼

A cooling system for a substrate comprising: a chuck having a top and a bottom, said top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, said liquid interface cooling circuit means having an input means and an output means;

A cooling system for a substrate comprising: a chuck having a top and a bottom, said top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, said liquid interface cooling circuit means having an input means and an output means; a source vessel connected to said input means for providing a first liquid to said liquid interface cooling circuit means, said source vessel maintaining said first liquid at atmospheric pressure; and, a collection vessel connected to said output means for collecting said first liquid, said collection vessel maintaining collected fluid below atmospheric pressure to thereby cause liquid to flow from said source vessel through said liquid interface cooling circuit means and into said collection vessel, wherein said liquid interface is adapted to provide both a clamping force to the substrate in order to clamp the substrate to said chuck and a cooling interface in order to cool the substrate.