이 특허를 인용한 특허 (49)

1. Iyer, Rajesh V., Capacitor for filtered feedthrough with annular member.

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2. Richard Long Lehman ; Yuya Umezu ; Jie Li ; Daniel Ely Murnick ; James Colaizzi, Coating and filler materials for use in localized thermal processing of glazed ceramics.

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3. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.

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4. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.

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5. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.

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6. Iyer, Rajesh V.; Marinkov, Michael G.; Nygren, Lea A.; Clayton, Jeffrey J.; Strom, James; Meyer, Thomas E.; Deininger, Steven T.; Kuechenmeister, Wayne R., Compact connector assembly for implantable medical device.

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7. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik, Display panel and manufacturing method of the same.

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8. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro, Durable tungsten-doped tin-fluorophosphate glasses.

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9. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik, Encapsulation sheet, method of manufacturing organic light emitting display device using the same, and organic light emitting display device.

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10. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik, Encapsulation sheet, method of manufacturing organic light emitting display device using the same, and organic light emitting display device.

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11. Taylor, William John; Tischendorf, Brad C., Feedthrough assembly including a ferrule, an insulating structure and a glass.

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12. Iyer, Rajesh V., Filtered feedthrough assembly and associated method.

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13. Iyer, Rajesh V., Filtered feedthrough assembly and associated method.

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14. Aitken, Bruce Gardiner; Bookbinder, Dana Craig; Garner, Sean Matthew; Quesada, Mark Alejandro, Flexible substrates having a thin-film barrier.

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15. Aitken, Bruce Gardiner; Bookbinder, Dana Craig; Garner, Sean Matthew; Quesada, Mark Alejandro, Flexible substrates having a thin-film barrier.

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16. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Frits for use in vacuum insulating glass (VIG) units, and/or associated methods.

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17. Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.

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18. Logunov, Stephan Lvovich; Quesada, Mark Alejandro, Glass sealing with transparent materials having transient absorption properties.

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19. Logunov, Stephan Lvovich; Quesada, Mark Alejandro, Glass sealing with transparent materials having transient absorption properties.

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20. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro, Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device.

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21. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro, Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device.

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22. Bellman, Robert Alan; Chuang, Ta-Ko; Manley, Robert George; Quesada, Mark Alejandro; Sachenik, Paul Arthur, High rate deposition systems and processes for forming hermetic barrier layers.

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23. Taylor, William John; Tischendorf, Brad C., Insulator for feedthrough.

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24. Orsley, Timothy James; Trutna, William Richard; Borrelli, Nicholas Francis; Lamberson, Lisa Ann; Morena, Robert Michael, LED lighting devices.

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25. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Laser welding transparent glass sheets using low melting glass or thin absorbing films.

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26. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Laser welding transparent glass sheets using low melting glass or thin absorbing films.

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27. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Laser welding transparent glass sheets using low melting glass or thin absorbing films.

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28. Aitken, Bruce Gardiner; Lewis, Mark Alan; Quesada, Mark Alejandro, Method for inhibiting oxygen and moisture degradation of a device and the resulting device.

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29. Dennis, Timothy A., Method of making vacuum insulated glass (VIG) window unit.

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30. Lehman Richard Long ; Umezu Yuya ; Li Jie ; Murnick Daniel Ely ; Colaizzi James, Method of thermally glazing an article.

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31. Iyer, Rajesh V., Methods to prevent high voltage arcing under capacitors used in filtered feedthroughs.

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32. Edwards, Victoria Ann; Giroux, Cynthia Baker; Koval, Shari Elizabeth; Quesada, Mark Alejandro; Walczak, Wanda Janina, Multi-laminate hermetic barriers and related structures and methods of hermetic sealing.

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33. Imashita Katsuhiro,JPX, Process for producing a glass melt.

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34. Farnworth Warren M. ; Wood Alan G., Process of making a glass semiconductor package.

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35. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Sealed devices comprising transparent laser weld regions.

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36. Aitken, Bruce Gardiner; An, Chong Pyung; Quesada, Mark Alejandro, Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device.

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37. Aitken, Bruce Gardiner; An, Chong Pyung; Quesada, Mark Alejandro, Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device.

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38. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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39. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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40. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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41. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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42. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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43. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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44. Warren M. Farnworth, Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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45. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same.

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46. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.

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47. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.

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48. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.

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49. Dennis, Timothy A., Vanadium-based frit materials, binders, and/or solvents and methods of making the same.

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