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특허 상세정보

Sealing materials and glasses

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C03C-008/14    C03C-008/18    C03C-008/24    C03C-014/00   
미국특허분류(USC) 501/15 ; 501/17 ; 501/19 ; 501/32
출원번호 US-0598001 (1990-10-09)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 49  인용 특허 : 0
초록

Mill additions are disclosed which lower the CTE of, and are compatible with, tin-phosphorus oxyfluoride glasses. The sealing materials provide fusion-type seals having a CTE not over about 110×10-7/°C. and a sealing temperature not over about 350°C. Also disclosed is a family of glass compositions in the tin-phosphorus oxyfluoride system that exhibit very low glass transition temperatures and coefficients of thermal expansion not over about 160×10-7/°C. (25°-150°C.). In addition to the four basic elements, the glasses contain up to 11% Nb, and may addit...

대표
청구항

A fusion sealing material composed of a tin-phosphorus oxyfluoride glass having a low transition temperature and a mill addition selected from the group consisting of Invar, molybdenum, tungsten, lead orthophosphate, magnesium pyrophosphate, a magnesium pyrophosphate with at least a portion of the magnesium ions replaced by at least one cation selected from the group composed of cobalt, arsenic, zinc, iron, aluminum and zirconium, and a crystallized phosphate glass composed essentially of P2O5 and one or more cations selected from the group composed of m...

이 특허를 인용한 특허 피인용횟수: 49

  1. Iyer, Rajesh V.. Capacitor for filtered feedthrough with annular member. USP2012128331077.
  2. Richard Long Lehman ; Yuya Umezu ; Jie Li ; Daniel Ely Murnick ; James Colaizzi. Coating and filler materials for use in localized thermal processing of glazed ceramics. USP2002126498116.
  3. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP20181110125045.
  4. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016069359247.
  5. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016109458052.
  6. Iyer, Rajesh V.; Marinkov, Michael G.; Nygren, Lea A.; Clayton, Jeffrey J.; Strom, James; Meyer, Thomas E.; Deininger, Steven T.; Kuechenmeister, Wayne R.. Compact connector assembly for implantable medical device. USP2013118593816.
  7. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik. Display panel and manufacturing method of the same. USP2017049634286.
  8. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro. Durable tungsten-doped tin-fluorophosphate glasses. USP2009117615506.
  9. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik. Encapsulation sheet, method of manufacturing organic light emitting display device using the same, and organic light emitting display device. USP2016089406906.
  10. Kim, Min-Soo; Park, Jin-Woo; Hyun, Won-Sik. Encapsulation sheet, method of manufacturing organic light emitting display device using the same, and organic light emitting display device. USP2014078778713.
  11. Taylor, William John; Tischendorf, Brad C.. Feedthrough assembly including a ferrule, an insulating structure and a glass. USP2012108288654.
  12. Iyer, Rajesh V.. Filtered feedthrough assembly and associated method. USP2013028373965.
  13. Iyer, Rajesh V.. Filtered feedthrough assembly and associated method. USP2015038982532.
  14. Aitken, Bruce Gardiner; Bookbinder, Dana Craig; Garner, Sean Matthew; Quesada, Mark Alejandro. Flexible substrates having a thin-film barrier. USP2013058435605.
  15. Aitken, Bruce Gardiner; Bookbinder, Dana Craig; Garner, Sean Matthew; Quesada, Mark Alejandro. Flexible substrates having a thin-film barrier. USP2012028115326.
  16. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Frits for use in vacuum insulating glass (VIG) units, and/or associated methods. USP2018069988302.
  17. Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto. Glass package that is hermetically sealed with a frit and method of fabrication. USP2011118063560.
  18. Logunov, Stephan Lvovich; Quesada, Mark Alejandro. Glass sealing with transparent materials having transient absorption properties. USP20180710011525.
  19. Logunov, Stephan Lvovich; Quesada, Mark Alejandro. Glass sealing with transparent materials having transient absorption properties. USP2017059666763.
  20. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro. Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device. USP2010117829147.
  21. Aitken, Bruce Gardiner; Koval, Shari Elizabeth; Quesada, Mark Alejandro. Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device. USP2012118304990.
  22. Bellman, Robert Alan; Chuang, Ta-Ko; Manley, Robert George; Quesada, Mark Alejandro; Sachenik, Paul Arthur. High rate deposition systems and processes for forming hermetic barrier layers. USP20180710017849.
  23. Taylor, William John; Tischendorf, Brad C.. Insulator for feedthrough. USP2012038129622.
  24. Orsley, Timothy James; Trutna, William Richard; Borrelli, Nicholas Francis; Lamberson, Lisa Ann; Morena, Robert Michael. LED lighting devices. USP20181210158057.
  25. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich. Laser welding transparent glass sheets using low melting glass or thin absorbing films. USP2017099761828.
  26. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich. Laser welding transparent glass sheets using low melting glass or thin absorbing films. USP2016129515286.
  27. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich. Laser welding transparent glass sheets using low melting glass or thin absorbing films. USP20180910069104.
  28. Aitken, Bruce Gardiner; Lewis, Mark Alan; Quesada, Mark Alejandro. Method for inhibiting oxygen and moisture degradation of a device and the resulting device. USP2015069050622.
  29. Dennis, Timothy A.. Method of making vacuum insulated glass (VIG) window unit. USP20181010107028.
  30. Lehman Richard Long ; Umezu Yuya ; Li Jie ; Murnick Daniel Ely ; Colaizzi James. Method of thermally glazing an article. USP2000106127005.
  31. Iyer, Rajesh V.. Methods to prevent high voltage arcing under capacitors used in filtered feedthroughs. USP2015049009935.
  32. Edwards, Victoria Ann; Giroux, Cynthia Baker; Koval, Shari Elizabeth; Quesada, Mark Alejandro; Walczak, Wanda Janina. Multi-laminate hermetic barriers and related structures and methods of hermetic sealing. USP2017019555595.
  33. Imashita Katsuhiro,JPX. Process for producing a glass melt. USP1998015709725.
  34. Farnworth Warren M. ; Wood Alan G.. Process of making a glass semiconductor package. USP1999095958100.
  35. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich. Sealed devices comprising transparent laser weld regions. USP2017089741963.
  36. Aitken, Bruce Gardiner; An, Chong Pyung; Quesada, Mark Alejandro. Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device. USP2010057722929.
  37. Aitken, Bruce Gardiner; An, Chong Pyung; Quesada, Mark Alejandro. Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device. USP2013058435604.
  38. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2004096791164.
  39. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2003076593171.
  40. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2003026514798.
  41. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2004086770514.
  42. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2005056890801.
  43. Farnworth, Warren M.. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2005106951779.
  44. Warren M. Farnworth. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages. USP2002086432752.
  45. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same. USP2017039593527.
  46. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20181010087676.
  47. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP2017109776910.
  48. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20190210196299.
  49. Dennis, Timothy A.. Vanadium-based frit materials, binders, and/or solvents and methods of making the same. USP2016049309146.