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Capacitance type accelerometer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/283
출원번호 US-0429546 (1989-10-31)
우선권정보 JP-0286714 (1988-11-15)
발명자 / 주소
  • Suzuki Seiko (Hitachioota JPX) Tsuchitani Shigeki (Mito JPX) Miki Masayuki (Katsuta JPX) Matsumoto Masahiro (Hitachi JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 76  인용 특허 : 0

초록

A capacitance type accelerometer, having a fist silicon plate formed a movable electrode which is moved according to acceleration, two second silicon plates which are disposed on both sides of the first silicon plate with a certain separation distance, and thermal oxide films which are respectively

대표청구항

A capacitance type accelerometer, having: a silicon plate including a portion formed as a movable electrode which is moved according to acceleration; glass plates respectively mounting a conductive layer thereon which are opposite to the silicon plate with a certain separation distance and are conne

이 특허를 인용한 특허 (76)

  1. Masahiro Matsumoto JP; Seikou Suzuki JP; Masayuki Miki JP, Acceleration sensor.
  2. Matsumoto Masahiro,JPX ; Suzuki Seikou,JPX ; Miki Masayuki,JPX, Acceleration sensor.
  3. Matsumoto, Masahiro; Suzuki, Seikou; Miki, Masayuki, Acceleration sensor.
  4. Ichikawa Junichi,JPX ; Kodama Seiki,JPX, Acceleration sensor and a method of producing same.
  5. Potter, Michael D., Accelerometer and methods thereof.
  6. Uwechue, Okechukwu Aniemeka, Accelerometer based on the measurement of Casimir force fluctuations.
  7. Stevenson Paul E. (Colorado Springs CO) Stephan Craig H. (Ann Arbor MI) Samman Amer M. (Dearborn MI) Spangler Leland J. (Manitou Springs CO), Accelerometer with a combined self-test and ground electrode.
  8. Johnson, Burgess R.; Supino, Ryan, All-silicon electrode capacitive transducer on a glass substrate.
  9. Adams, Scott G.; Davis, Tim, Boundary isolation for microelectromechanical devices.
  10. MacDonald Noel C. (Ithaca NY) Bertsch Fred M. (Ithaca NY) Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY), Capacitance based tunable micromechanical resonators.
  11. Torregrosa Michel (Beaumont les Valence FRX), Capacitive accelerometer with a circuit for correcting stray capacitance perturbations.
  12. Silverbrook, Kia, Chip with molded cap array.
  13. Silverbrook,Kia, Chips with wafer scale caps formed by molding.
  14. Gutierrez Adolfo O. ; Edmans Daniel M. ; Cormeau Christopher, Differential wideband vibration.
  15. Fujiyoshi,Motohiro; Nonomura,Yutaka; Sugihara,Hisayoshi, Displacement sensor.
  16. Furuhata, Makoto, Electronic device, electronic apparatus, and moving object.
  17. Adams, Scott; Davis, Tim; Miller, Scott; Shaw, Kevin; Chong, John Matthew; Lee, Seung Bok (Chris), Electrostatic actuator for micromechanical systems.
  18. Koyama, Mitsuaki; Mutoh, Takeru; Iwai, Hiroki; Ichikawa, Ryoichi, External force detection apparatus and external force detection sensor.
  19. Okada, Kazuhiro, Force detector and acceleration detector and method of manufacturing the same.
  20. Okada,Kazuhiro, Force detector and acceleration detector and method of manufacturing the same.
  21. Potter, Michael D., High temperature embedded charge devices and methods thereof.
  22. Funabashi, Hirofumi; Nonomura, Yutaka; Hata, Yoshiyuki; Fujiyoshi, Motohiro; Akashi, Teruhisa; Omura, Yoshiteru, MEMS structure and manufacturing method thereof.
  23. Fujii Tetsuo (Toyohashi JPX) Imai Masahito (Chita JPX), Mechanical force sensing semiconductor device.
  24. Ueyanagi Katsumichi,JPX, Method for making a semiconductor acceleration sensor.
  25. Fujii Tetsuo,JPX ; Imai Masahito,JPX, Method for manufacturing a mechanical force sensing semiconductor device.
  26. Potter,Michael D., Method for non-damaging charge injection and a system thereof.
  27. Potter,Michael D., Method for non-damaging charge injection and system thereof.
  28. Silverbrook,Kia, Method of fabricating an array of wafer scale polymeric caps.
  29. Chong, John M.; Waldrop, Paul; Davis, Tim; Adams, Scott, Method of fabricating semiconductor wafers having multiple height subsurface layers.
  30. Bergstedt, Leif; Andersson, Gert; Ottosson, Britta, Method relating to anodic bonding.
  31. Potter,Michael D., Methods for distributed electrode injection.
  32. Potter,Michael D., Micro fluidic valves, agitators, and pumps and methods thereof.
  33. Potter,Michael D., Micro-electro-mechanical switch and a method of using and making thereof.
  34. Bowers, John Edward; Helkey, Roger Jonathan; Corbalis, Charles; Sink, Robert Kehl; Lee, Seung Bok; MacDonald, Noel, Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same.
  35. Lee, Seung Bok; MacDonald, Noel, Micro-electro-mechanical-system (MEMS) mirror device having large angle out of plane motion using shaped combed finger actuators and method for fabricating the same.
  36. Mark A. Lemkin ; Allen W. Roessig ; Thor Juneau ; William A. Clark, Micro-machined accelerometer with improved transfer characteristics.
  37. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Microelectromechanical accelerometer for automotive applications.
  38. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  39. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  40. Yu, Duli; Feng, Fangfang; Han, Kedu, Micromachined accelerometer with monolithic electrodes and method of making the same.
  41. MacDonald Noel C. ; Shaw Kevin A. ; Adams Scott G., Micromechanical accelerometer for automotive applications.
  42. Liwei Lin ; Yu-Ting Cheng ; Khalil Najafi ; Kensall D. Wise, Microstructures.
  43. Silverbrook,Kia, Mold making method for wafer scale caps.
  44. Silverbrook, Kia, Molded wafer scale cap.
  45. Silverbrook,Kia, Molded wafer scale cap array.
  46. Potter,Michael D., Motion based, electrostatic power source and methods thereof.
  47. Adams Scott G. ; Wang Yongmei Cindy ; Macdonald Noel C. ; Thorp James S., Multistable tunable micromechanical resonators.
  48. Kamisuki, Shinichi, Physical quantity sensor and electronic apparatus.
  49. Silverbrook,Kia, Placement tool for wafer scale caps.
  50. Lemkin, Mark A.; Juneau, Thor N.; Clark, William A.; Roessig, Allen W., Position sensing with improved linearity.
  51. Lin Liwei ; Cheng Yu-Ting ; Najafi Khalil ; Wise Kensall D., Process for making microstructures and microstructures made thereby.
  52. Potter,Michael D., Rotational motion based, electrostatic power source and methods thereof.
  53. Matsunaga Tadao,JPX ; Kunimi Takashi,JPX ; Nezu Masahiro,JPX ; Mori Masatomo,JPX ; Esashi Masayoshi,JPX, Semiconductor acceleration sensor and its self-diagnosing method.
  54. Ueyanagi Katsumichi,JPX, Semiconductor acceleration sensor and testing method thereof.
  55. Yokota Yoshihiro (Katsuta JPX) Naito Shotaro (Katsuta JPX) Suzuki Toshihiko (Katsuta JPX) Koide Akira (Chiyoda-machi JPX), Semiconductor accelerometer.
  56. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  57. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  58. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  59. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  60. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  61. Fujii,Tetsuo; Imai,Masahito, Semiconductor mechanical sensor.
  62. Fujii,Tetsuo; Imai,Masahito, Semiconductor mechanical sensor.
  63. Masahito Imai JP, Semiconductor mechanical sensor.
  64. Tetsuo Fujii JP; Masahito Imai JP, Semiconductor mechanical sensor.
  65. Fujii Tetsuo,JPX ; Imai Masahito,JPX, Semiconductor mechanical sensor and method of manufacture.
  66. Selvakumar,Arjun; Goldberg,Howard D.; Yu,Duli; Ip,Matthew; Schmidt,Martin A.; Marsh,James L.; Fung,Bing Fai; Simon,Philip, Sensor design and process.
  67. Chong, John; Lee, Seung Bok; MacDonald, Noel; Lewis, Robert; Hunt, Peter, Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same.
  68. Choi, Sang J., Shock sensor by variable capacitor.
  69. Matsumoto, Masahiro; Suzuki, Seikou; Miki, Masayuki, Structure for mounting components.
  70. Masahiro Matsumoto JP; Seikou Suzuki JP; Masayuki Miki JP, Surface mount type package unit.
  71. Fawcett John Neville,GBX, Transducer.
  72. Silverbrook,Kia, Two part mold for wafer scale caps.
  73. Hopkins, Andrew David, Ultrasound probe with accelerometer.
  74. Silverbrook, Kia, Wafer scale caps located by molding.
  75. Silverbrook, Kia, Wafer scale molding of protective caps.
  76. Edmans Daniel M. ; Gutierrez Adolfo ; Cormeau Christopher ; Maby Edward, Wideband vibration sensor.
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