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Heat treating apparatus with cooling fluid nozzles 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-003/64
  • F27B-005/16
  • F27D-009/00
출원번호 US-0624473 (1990-12-10)
우선권정보 JP-0148676 (1988-06-16); JP-0053508 (1989-03-06)
발명자 / 주소
  • Nakao Ken (Sagamihara JPX)
출원인 / 주소
  • Tel Sagami Limited (Kanagawa JPX 03)
인용정보 피인용 횟수 : 39  인용 특허 : 0

초록

A cooling system is disclosed which is incorporated in a heat treating apparatus for use in a manufacturing process of a semiconductor device etc. The heat treating apparatus includes a reaction tube for receiving products to be heat treated in its uniformly heated zone, and a heater which surrounds

대표청구항

A vertical type heat-treating apparatus, comprising: a reaction tube extending substantially vertically along a longitudinal direction and containing a uniformly heated zone in which an object to be heat-treated is received; a coil-like heater surrounding the reaction tube; a liner tube provided bet

이 특허를 인용한 특허 (39)

  1. Deuk Ik Ji (Suwon KRX) Jong Youb Kim (Suwon KRX), Air flow control apparatus in an air conditioner.
  2. Reynolds, Reese; Lucas, Jr., H. William; Johnson, Tyke, Apparatus for manufacture of solar cells.
  3. Kuppurao, Satheesh; Carlson, David K.; Hemkar, Manish; Lam, Andrew; Sanchez, Errol; Beckford, Howard, Apparatus to control semiconductor film deposition characteristics.
  4. Patrick Leahey ; Jerry C. Chen ; Richard E. Remington ; Simon Yavelberg ; Timothy Driscoll ; Robert E. Ryan ; Brian Hatcher ; Rolf Guenther ; Xueyu Qian, Closed-loop dome thermal control apparatus for a semiconductor wafer processing system.
  5. Kim, Seunggi, Cooling apparatus for vehicle.
  6. Chu, Eric; Chiang, Kevin; Tseng, Ling-Hsin; Yew, Ken, Cooling system for reducing particles pollution.
  7. Ito, Hideki; Tsumori, Toshiro; Suzuki, Kunihiko; Tsuchida, Hidekazu; Kamata, Isaho; Ito, Masahiko; Naito, Masami; Fujibayashi, Hiroaki; Adachi, Ayumu; Nishikawa, Koichi, Film-forming manufacturing apparatus and method.
  8. Mellen, Jonathan Y., Furnace system with active cooling system and method.
  9. Nakao, Ken; Kato, Kazuhiko, Heat processing apparatus.
  10. Miyashita Naoto,JPX ; Katakabe Ichiro,JPX ; Kawamoto Hiroshi,JPX ; Doi Kenji,JPX ; Okuda Tsuyoshi,JPX, Heat treatment apparatus for semiconductor wafers.
  11. Kobayashi, Makoto; Yamaga, Kenichi; Saito, Takanori, Heat treatment apparatus, heater, and method for manufacturing the heater.
  12. Carlson David K. ; Riley Norma ; Anderson Roger N., Method and apparatus for controlling the temperature of reaction chamber walls.
  13. Strang, Eric J., Method and apparatus for gas injection system with minimum particulate contamination.
  14. Paranjpe,Ajit P., Method and apparatus for layer by layer deposition of thin films.
  15. Habuka Hitoshi,JPX ; Mayuzumi Masanori,JPX ; Tate Naoto ; Katayama Masatake,JPX, Method and apparatus for thin film growth.
  16. Carlson David K. ; Riley Norma ; Anderson Roger N., Method for controlling the temperature of the walls of a reaction chamber during processing.
  17. Turner Norman L. (Mountain View CA) White John MacNeill (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area glass substrates.
  18. Turner Norman L. (Mountain View CA) White John M. (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area substrates and apparatus therefor.
  19. Sikka Vinod K. ; Whitson Barry G. ; Blue Craig A., Method of using infrared radiation for assembling a first component with a second component.
  20. Apps William P. (Alpharetta GA) Koefelda Gerald R. (Atlanta GA), Nestable crate with handle.
  21. Apps William P. ; Koefelda Gerald R., Nestable display crate for bottles with handle feature.
  22. Onodera, Naomi; Gokon, Kiyohiko; Sato, Jun, Plasma process apparatus and plasma process method.
  23. Onodera, Naomi; Gokon, Kiyohiko; Sato, Jun, Plasma process method.
  24. Cantrell David Michael, Portable cooling system for use with a semiconductor fabrication system.
  25. Lee, Kyo yeol; Lee, Eun hye, Pyrolysis furnace having gas flowing path controller.
  26. van Bilsen, Franciscus B., Reaction chamber with decreased wall deposition.
  27. Bolton Douglas A. ; Wiesen Patrick W., Semiconductor thermal processor with recirculating heater exhaust cooling system.
  28. Miura, Atsuyasu, Substrate processing apparatus.
  29. Cho, Cheon-Soo; Youn, Dong-Sik; Lee, Hyun-Wook; Ha, Samchul, Surface treatment system and method.
  30. Cowans, Kenneth W., Systems and methods for temperature control.
  31. Nishimoto, Shinya, Temperature adjusting mechanism and semiconductor manufacturing apparatus using temperature adjusting mechanism.
  32. Cowans Kenneth W., Temperature control of individual tools in a cluster tool system.
  33. Cowans Kenneth W., Temperature control of individual tools in a cluster tool system.
  34. Kenneth W. Cowans, Temperature control of individual tools in a cluster tool system.
  35. Cook, Robert C.; Brors, Daniel L., Thermal gradient enhanced CVD deposition at low pressure.
  36. Kowalski Jeffrey M. ; Ratliff Christopher T. ; Koble ; Jr. Terry A. ; Pack Jon H. ; Yang Michael H., Thermal processing apparatus.
  37. Saito, Takanori; Serizawa, Kazuhide; Ichikawa, Takashi, Thermal processing method and thermal processing unit.
  38. Cook Robert C. ; Brors Daniel L., Vertical plasma enhanced process apparatus and method.
  39. Peck,Kevin B.; Soliday,Mike D.; Sanches,Jim, Vestibule assembly for a heat treatment furnace.
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