초록 ▼

An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable bath formulations employing various buffers,

An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable bath formulations employing various buffers, reducing agents and ligands have been developed. The process can be used for metal deposition at lower pH and provides the capability to use additive processing for metallization in the presence of polyimide, positive photoresist and other alkali sensitive substrates.

대표청구항 ▼

An alkali sensitive substrate deposited with copper from an electroless plating bath, the bath consisting of: ________________________________ - 64 mM tetra-aza ligand 32 mM Copper sulfate 68 mM DMAB 10 to 50 mg/l Hexadecyl Trimethylammonium hydroxide 30 to 600 mg/l 2,2 Bipyridine __________________

An alkali sensitive substrate deposited with copper from an electroless plating bath, the bath consisting of: ________________________________ - 64 mM tetra-aza ligand 32 mM Copper sulfate 68 mM DMAB 10 to 50 mg/l Hexadecyl Trimethylammonium hydroxide 30 to 600 mg/l 2,2 Bipyridine ________________________________ and a sufficiently quantity of buffering agent selected from the group consisting of valine, Tris (hydroxymethyl), aminomethane, borax, triethanalomine, NaOH, triisopropanalamine and ethanolamine and wherein said tetra-aza ligand is selected from the group consisting of 1,5,8,12 tetraazadodecane, 1,4,8,11 tetraazaundecane, 1,4,8,11 tetraazacyclotetradecane and 1,4,8,12 tetraazacyclopentadecane, and a sufficient amount of acid to adjust the pH to be in the range between 7 and 12, wherein said acid is selected from the group consisting of sulfuric acid and boric acid wherein the electroless plated copper has a resistivity in the range between substantially 1.9 and 2.0 microohm cm.