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Polyamide composite material and method for preparing the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08J-003/20
  • C08K-003/34
  • C08L-077/00
출원번호 US-0518736 (1990-05-02)
우선권정보 JP-0124402 (1989-05-19)
발명자 / 주소
  • Deguchi Ryuichi (Ube JPX) Nishio Takeyoshi (Okazaki JPX) Okada Akane (Obu JPX)
출원인 / 주소
  • Ube Industries, Ltd. (Ube JPX 03) Toyota Jidosha Kabushiki Kaisha (Toyota JPX 03) Kabushiki Kaisha (Aichi JPX 03)
인용정보 피인용 횟수 : 115  인용 특허 : 0

초록

Disclosed is a polyamide composite material comprising (A) 100 parts by weight of a polyamide resin and (B) 0.05 to 30 parts by weight of a layered silicate uniformly dispersed in the component (A), wherein the reaction ratio of the components (A) and (B) is 60% or less. Disclosed is also a method f

대표청구항

A method for preparing a polyamide composite material comprising forming a composite by admixing a layered silicate having a cation exchange capacity of 50 to 200 milliequivalents/100 g with a dispersion medium, whereby said layered silicate swells and has a swelling degree of 5 cc/g or more, said d

이 특허를 인용한 특허 (115)

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