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Method of making a resin encapsulated pin grid array with integral heatsink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/56
  • H01L-021/58
출원번호 US-0652191 (1991-02-06)
발명자 / 주소
  • Ishida Yoshihiro (Tokorozawa JPX) Komatsu Katsuji (Kawagoe JPX) Mimura Seiichi (Kawagoe JPX) Takenouchi Kikuo (Higashimurayama JPX) Yabe Isao (Tokorozawa JPX) Ichikawa Shingo (Sayama JPX) Shimada Yos
출원인 / 주소
  • Citizen Watch Co., Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 54  인용 특허 : 0

초록 ▼

A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulat

대표청구항 ▼

A method of manufacturing a semiconductor device with a heat radiating member in which an IC chip is mounted on a resin substrate having a plurality of contact pins on a lower surface thereof and being resin-encapsulated by injection molding with a mold having a lower half and an upper half, the hea

이 특허를 인용한 특허 (54)

  1. Bolken,Todd O., Alternative method used to package multimedia card by transfer molding.
    상세보기
  2. Weber Patrick O., Apparatus for encapsulating electronic packages.
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  3. Weber Patrick O. (San Jose CA), Apparatus for encapsulating electronic packages.
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  4. Hembree David R., Attachment method for heat sinks and devices involving removal of misplaced encapsulant.
    상세보기
  5. Mahulikar Deepak ; Hoffman Paul R. ; Braden Jeffrey S., Ball grid array electronic package.
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  6. Hembree, David R., Chip on board and heat sink attachment methods.
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  7. Hembree, David R., Chip on board and heat sink attachment methods.
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  8. Hembree, David R., Chip on board and heat sink attachment methods.
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  9. Hembree,David R., Chip on board and heat sink attachment methods.
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  10. Hembree David R., Chip on board with heat sink attachment.
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  11. Hembree, David R., Chip on board with heat sink attachment and assembly.
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  12. Furukawa, Koji, Connector.
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  13. Wensel Richard W., Encapsulated transfer molding of a semiconductor die with attached heat sink.
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  14. Moden Walter L. ; Corisis David J. ; Kinsman Larry D. ; Mess Leonard E., Heat sink with alignment and retaining features.
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  15. Moden, Walter L.; Corisis, David J.; Kinsman, Larry D.; Mess, Leonard E., Heat sink with alignment and retaining features.
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  16. Moden, Walter L.; Corisis, David J.; Kinsman, Larry D.; Mess, Leonard E., Heat sink with alignment and retaining features.
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  17. Jang, Ki Youn; Song, Sungmin; Bae, JoHyun, Integrated circuit package system employing mold flash prevention technology.
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  18. Kuan, Heap Hoe; Chua, Pei Ee; Chow, Seng Guan, Integrated circuit package system employing resilient member mold system technology.
    상세보기
  19. Ito, Youkou; Ohba, Takashi, Intermediate structure of semiconductor device and method of manufacturing the same.
    상세보기
  20. Richard W. Wensel, Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink.
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  21. Coico, Patrick A.; Edwards, David L.; Indyk, Richard F.; Long, David C., Method and structure to improve thermal dissipation from semiconductor devices.
    상세보기
  22. Dennis William K., Method for making light transparent package for integrated circuit.
    상세보기
  23. Nishihara Syoujirou,JPX ; Nishinaka Teruaki,JPX, Method for packaging electronic device.
    상세보기
  24. Wensel Richard W., Method for transfer molding encapsulation of a semiconductor die with attached heat sink.
    상세보기
  25. Bolken,Todd O., Method for two-stage transfer molding device to encapsulate MMC module.
    상세보기
  26. David R. Hembree, Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package.
    상세보기
  27. David R. Hembree, Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package.
    상세보기
  28. Wensel, Richard W., Methods for transfer molding encapsulation of a semiconductor die with attached heat sink.
    상세보기
  29. Yean, Tay Wuu; Ai-Chie, Wang, Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages.
    상세보기
  30. Wellinsky Wayne T. ; Juntwait Eric D., Overmolded connector and method for manufacturing same.
    상세보기
  31. Liang, Le; Hong, Shou-Yu; Zhao, Zhen-Qing, Package module having exposed heat sink.
    상세보기
  32. Yoshihiro Tomita JP; Hironori Matsushima JP; Hirofumi Makimoto JP, Radiating plate structure and method for manufacturing semiconductor devices using the same structure.
    상세보기
  33. Ochi, Takao, Semiconductor apparatus including a heat dissipating member.
    상세보기
  34. Sato Mitsutaka (Kawasaki JPX) Kasai Junichi (Kawasaki JPX) Yoshimoto Masanori (Kawasaki JPX) Takeshita Kouichi (Satsuma JPX), Semiconductor device affixed to an upper and a lower leadframe.
    상세보기
  35. Sono Michio (Kawasaki JPX) Saito Kouji (Kawasaki JPX) Takenaka Masashi (Kawasaki JPX) Yoshimoto Masanori (Kawasaki JPX), Semiconductor device having radiator structure.
    상세보기
  36. Yoneda Yoshiyuki (Kawasaki JPX) Tsuji Kazuto (Kawasaki JPX), Semiconductor device in a resin package housed in a frame having high thermal conductivity.
    상세보기
  37. Richard W. Wensel, Semiconductor die with attached heat sink and transfer mold.
    상세보기
  38. Wensel, Richard W., Semiconductor die with attached heat sink and transfer mold.
    상세보기
  39. Wensel,Richard W., Semiconductor die with attached heat sink and transfer mold.
    상세보기
  40. Lee, Jung-Yu; Tzu, Chung-Hsing, Semiconductor package for efficient heat spreading.
    상세보기
  41. Moden Walter L. ; Corisis David J. ; Mess Leonard E. ; Kinsman Larry D., Stackable ceramic FBGA for high thermal applications.
    상세보기
  42. Moden, Walter L.; Corisis, David J.; Mess, Leonard E.; Kinsman, Larry D., Stackable ceramic FBGA for high thermal applications.
    상세보기
  43. Moden, Walter L.; Corisis, David J.; Mess, Leonard E.; Kinsman, Larry D., Stackable ceramic FBGA for high thermal applications.
    상세보기
  44. Moden,Walter L.; Corisis,David J.; Mess,Leonard E.; Kinsman,Larry D., Stackable ceramic FBGA for high thermal applications.
    상세보기
  45. Moden, Walter L.; Corisis, David J.; Mess, Leonard E.; Kinsman, Larry D., Stackable ceramic fbga for high thermal applications.
    상세보기
  46. Liang, Le; Hong, Shou-Yu; Zhao, Zhen-Qing, Stacked package module having an exposed heat sink surface from the packaging.
    상세보기
  47. Caletka David V. ; Dery Jean,CAX ; Duchesne Eric,CAX ; Gaynes Michael A. ; Johnson Eric A. ; Matienzo Luis J. ; Wilcox James R., Thermally enhanced and mechanically balanced flip chip package and method of forming.
    상세보기
  48. Chen C. S.,TWX ; Cheng Sherman,TWX ; Tseng C. Y.,TWX ; Fong C. S.,TWX, Transfer molding process using self-straightening alignment pins.
    상세보기
  49. Theurer Josef (Vienna ATX) Brunninger Manfred (Altenberg ATX), Transport wagon for transporting track panels.
    상세보기
  50. Todd O. Bolken, Two stage transfer molding method to encapsulate MMC module.
    상세보기
  51. Bolken, Todd O., Two-stage transfer molding device to encapsulate MMC module.
    상세보기
  52. Bolken,Todd O., Two-stage transfer molding device to encapsulate MMC module.
    상세보기
  53. Bolken, Todd O., Two-stage transfer molding method to encapsulate MMC module.
    상세보기
  54. Bolken, Todd O., Two-stage transfer molding method to encapsulate MMC module.
    상세보기

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