[특허]Pluggable electronic circuit package assembly with snap together heat sink housing

Pluggable electronic circuit package assembly with snap together heat sink housing 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20 H01L-023/40
출원번호	US-0520011 (1990-05-07)
발명자 / 주소	Funari Joseph (Vestal NY) Godown Terence C. (Endwell NY) Reynolds Scott D. (Endwell NY) Sammakia Bahgat G. (Johnson City NY)
출원인 / 주소	International Business Machines Corporation (Armonk NY 02)
인용정보	피인용 횟수 : 117 인용 특허 : 0

초록 ▼

A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing. The heat sink housing has internal retention posts and internal posts receiving recesses that allow the two pieces to be snap fit together for easy assembly and disassembly. Also, a resilient latches the connector to the assembly. In one embodiment, the latch latches the connector to the assembly\s printed circuit substrate, the edge of which substrate plugs into the connector. In other embodiments, the latch latches the connector to the assembly\s heat sink housing. Also, in one embodiment, the latch is demountable and combined with an external clamp.

대표청구항 ▼

An electronic circuit package assembly pluggable into an edge type connector, said assembly comprising: a planar printed circuit substrate having a rectangular configuration and first and second parallel major outer surfaces with first and second predetermined circuit patterns, respectively, thereon, and conductive means in said substrate for interconnecting said first and second patterns, said substrate having a predetermined first region including therein a portion of at least said first circuit pattern, said portion having at least one row of input/output printed circuit terminals, said row of input/output printed circuit terminals being in substantial proximity alignment with and located in substantial proximity to a predetermined edge of said substrate, said predetermined edge and said input/output printed circuit terminals being pluggable into a compatible edge type connector for connection thereto; at least one first row of first integrated circuit chip means mounted on said first major surface and connected to said first circuit pattern; at least one second row of second integrated circuit chip means mounted on said second major surface and connected to said second circuit pattern, said mounted first and second chip means having a predetermined first height profile, said first and second rows of mounted chip means being in substantial parallel alignment with said predetermined edge, said mounted first and second chip means further being located in a second region of said substrate; at least one row of circuit components mounted on at least a predetermined one of said major surfaces and connected to said circuit pattern on said predetermined one of said major surfaces on which said circuit components are mounted, said mounted circuit components having a predetermined second height profile larger than said first height profile, said row of said circuit components being in substantial parallel alignment with said predetermined edge, said circuit components further being located in a third region of said substrate; heat sink housing means having first and second heat sink housing members in an abutting facing relationship defining an enclosure, said enclosure enclosing therein said second and third regions of said substrate and said mounted chip means and said circuit components located respectively therein, said first region and said predetermined edge being extended outwardly from said enclosure; and retention means for retaining said first and second heat sink housing members together and said substrate in registration with said enclosure defined thereby, said retention means further comprising a first retention post extending from one of said first and second heat sink housing members and a first recess in the other of said first and second heat sink housing members for receiving therein said first post with a predetermined tolerance fit to retain said first and second heat sink housing members together, said substrate further having a first opening extending there through, said first post passing through said first opening to maintain said substrate in said registration with said enclosure.

이 특허를 인용한 특허 (117)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Pluggable electronic circuit package assembly with snap together heat sink housing 원문보기

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Pluggable electronic circuit package assembly with snap together heat sink housing 원문보기

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이 특허를 인용한 특허 (117)

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