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The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resisti

The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resistive alloy (3) which is engraved to provide a sinuous resistance. The layer of resin (6) leaves in the area of the two opposite sides of the substratum (1), two free areas (5), at the extremities of the engraved resistive sheet (3). These two parts (5) of the resistive sheet are each covered by a thin layer (8) of a metal or alloy adhering to the resistive sheet (3), this layer (8) being covered by a second thicker layer (9) of metal or conductive alloy, and this second layer (9) being covered by a third, also thicker layer (14) of a solderable metal, these three superimposed layers (8, 9, 14) spreading equally over both lateral sides opposite the substratum (1) and partially on its face (13) opposite the engraved resistive sheet (3).

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In a chip form electrical resistance, designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum, including an electrically insulating substratum (1) of the ceramic type, on which is combined by an adhesive layer or organic resin (2), a sheet (3) of metal or resisti

In a chip form electrical resistance, designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum, including an electrically insulating substratum (1) of the ceramic type, on which is combined by an adhesive layer or organic resin (2), a sheet (3) of metal or resistive alloy, this sheet being engraved in order to form filaments (4) connected together to constitute a sinuous resistive circuit, this resistive sheet (3), being covered by another layer (6) of organic resin; the improvement in which said another layer of resin leaves free near the two opposite sides of the substratum (1), two parts (5, 5a) at the extremity of the resistive sheet (3), these two parts (5, 5a) of the resistive sheet being each covered by a thin layer (8) of a metal or alloy adhering shape-matingly to the resistive sheet (3), said layer (8) of a metal or alloy being covered by a second thicker layer (9) of metal or conductive alloy, and said second layer (9) being covered by a third layer (14) also thicker of a solderable alloy, these three layers (8, 9, 14) being superimposed and extending equally and shapematingly over the two lateral and opposite sides of the substratum (1) and partially over the face (13) of the substratum opposite to the resistive sheet (3).