초록 ▼

A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the core of the board may be parallel to the mount

A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the core of the board may be parallel to the mounting surface of the core throughout their length. The device may include at least two thermally conductive wedges embedded in the core for conducting heat into and out of the interior of the core. The wedges may be milled metal that may be mechanically and/or thermally attached to the composite material. The wedges may also be chemically plated to the composite. A plurality of the fibers contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that cavities for the wedges may be milled in the composite material of the core.

대표청구항 ▼

A lightweight electronic component mounting board suitable for use in an airborne environment comprising: (1) a generally flat core adapted to receive an electronic component in a heat transfer relationship to a mounting surface, said core (a) having a depth relatively small when compared to the len

A lightweight electronic component mounting board suitable for use in an airborne environment comprising: (1) a generally flat core adapted to receive an electronic component in a heat transfer relationship to a mounting surface, said core (a) having a depth relatively small when compared to the length and width thereof and (b) being comprised of heat conducting fibers in a binder, said conducting fibers being disposed generally parallel to said mounting surface with their longitudinal axis generally parallel to the length of said core; (2) a first wedge carried by said core and adapted to be in a heat transfer relationship to a heat generating electronic component when such component is mounted on said board, said first wedge extending into the depth of said core in a heat transfer relationship with said conducting fibers embedded therein; and (3) a second wedge carried by said core adjacent one longitudinal end thereof, said second wedge (a) being adapted to transfer heat to a heat sink (b) extending cross the width of said core a distance substantially the same as the width of said first wedge, (c) extending into the depth of said core a distance substantially the same as the depth of said first wedge, and (d) being in a heat transfer relationship with said conducting fibers embedded therein, whereby heat generated by a component mounted on said board may be conducted by said first wedge into the depth of said core into contact with said conducting fibers therein and to said second wedge for transfer to a heat sink.